Industry News: paste viscosity problems (Page 4 of 40)

> FREE Registration for June 12-13, held in The Netherlands

Industry News | 2013-05-01 12:45:51.0

Held at the Rijckholt Castle and Nordson ASYMTEK European Headquarters in Maastricht

ASYMTEK Products | Nordson Electronics Solutions

IPC And NPL Team Up To Solve Industry Process Issues With Free Defect Clinic At IPC APEX Expo 2011

Industry News | 2011-02-09 14:50:49.0

Manufacturing and quality engineers looking for solutions to process challenges will have an additional resource for answers with the new Process Defect Clinic at the IPC APEX EXPO conference and exhibition, April 12–14, 2011, in Las Vegas. Sponsored by IPC and the National Physical Laboratory (NPL), the free clinic will be held in booth 217 on the show floor to assist event attendees with assembly and soldering process problems, RoHS compliance issues, solderability concerns, field failures and other process-related issues.

Association Connecting Electronics Industries (IPC)

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Industry News | 2011-05-03 22:50:52.0

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Association Connecting Electronics Industries (IPC)

SMTA Capital Chapter to Host Chapter Tutorial Program on March 15th

Industry News | 2018-01-31 17:46:49.0

The SMTA Capital Chapter is pleased to announce that it will host a Chapter Tutorial Program on March 15th from 9AM to 3PM in Rockville, MD. Phil Zarrow, ITM consulting, will present “Understanding and Implementing Best Practices in Electronic Assembly Processes”.

Surface Mount Technology Association (SMTA)

New IPC Study Sheds Light on Labor Shortage in North American Electronics Industry

Industry News | 2015-03-05 18:22:11.0

A new study, published by IPC – Association Connecting Electronics Industries® finds evidence that a labor shortage exists for electronics manufacturers and that other business issues make the problem worse for some segments of the industry. Based on data from 107 U.S. and Canadian electronics manufacturers and extensive secondary research, IPC Study of the North American Labor Pool for Electronics Manufacturing assesses the causes of the shortage of qualified labor for electronics manufacturing, and offers solutions.

Association Connecting Electronics Industries (IPC)

Gaining a Competitive Edge in Eastern Europe’s Fast-growing Electronics Assembly Market

Industry News | 2012-10-16 18:56:39.0

IPC — Association Connecting Electronics Industries® will hold “IPC Conference on Solderability and Reliability for Electronics Assemblies” on 6-7 February 2013, in Budapest, Hungary.

Association Connecting Electronics Industries (IPC)

Cleaning Up the No-Clean Myth - IPC Releases New Update of Guidelines for Cleaning of Printed Boards & Assemblies

Industry News | 2011-07-26 22:29:00.0

It’s well-known that residues on printed board assemblies can lead to serious reliability problems. To help the process engineering community deal with these difficulties, IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies.

Association Connecting Electronics Industries (IPC)

SMTA Capital Chapter Meeting – Soldering Challenges in a Halogen-Free PCB Assembly Process

Industry News | 2011-04-22 21:54:12.0

The Capital Chapter is announcing its next SMTA meeting to be held at APL, Johns Hopkins University, in Laurel MD on May 17, 2011 from 5pm-8pm.

Surface Mount Technology Association (SMTA)

SMTA International Features Package-on-Package (PoP) Design and Assembly Center and Free Webinar

Industry News | 2012-07-12 10:34:27.0

The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.

Surface Mount Technology Association (SMTA)


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