Industry News: pb free bga (Page 1 of 93)

MIRTEC Europe and pb tec solutions to Display Revolutionary 2D/3D AOI Technology at SMT/Hybrid/Packaging 2015

Industry News | 2015-04-07 11:25:45.0

MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.

MIRTEC Corp

MIRTEC Europe and pb tec solutions to Display the Revolutionary 2D/3D AOI Technology at SMT/Hybrid/Packaging 2014

Industry News | 2014-04-22 14:31:18.0

MIRTEC announces that it will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7-504, at the SMT/Hybrid/Packaging 2014 exhibition, scheduled to take place May 6-8, 2014 in Nuremberg, Germany.

MIRTEC Corp

Dr. Jennie Hwang to deliver five-Part Lead-free tutorials in Orlando, FL on January 23, 24, 25, 2006

Industry News | 2005-12-29 16:54:11.0

The only complete coverage on Lead-Free from Preparation to Production to Reliability

Blackfox Training Institute, LLC

Dr. Jennie Hwang to deliver five-part lead-free tutorials in Dallas, TX

Industry News | 2005-09-19 15:54:56.0

The only complete coverage on Lead-Free from Preparation to Production to Reliability

Blackfox Training Institute, LLC

MIRTEC Europe to Exhibit at SMT/Hybrid/Packaging 2018

Industry News | 2018-05-20 18:35:56.0

MIRTEC, “The Global Leader in Inspection Technology,” today announced they will display their 3D AOI systems, MV-6 OMNI and MV-3 OMNI, as well as their total quality management system software, INTELLISYS, in distributor pb tec’s booth in Hall 4A, Stand 140 at the upcoming SMT/Hybrid/Packaging Show, scheduled to take place June 05-07, 2018, at the Messe in Nuremberg, Germany.

MIRTEC Corp

MIRTEC Europe to Exhibit at SMT/Hybrid/Packaging 2017

Industry News | 2017-04-22 12:38:58.0

MIRTEC, “The Global Leader in Inspection Technology,” today announced they will display their award-winning 3D AOI and SPI Inspection Systems in pb tec’s booth, in Hall 4A, Stand 140 at the upcoming SMT/Hybrid/Packaging Show, scheduled to take place May 16-18 at the Messe in Nuremberg, Germany.

MIRTEC Corp

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

MIRTEC TO PREMIER ITS COMPLETE LINE OF TECHNOLOGICALLY ADVANCED AUTOMATED OPTICAL INSPECTION SYSTEMS AT APEX 2010

Industry News | 2010-03-24 12:21:18.0

MIRTEC, "The Global Leader in Inspection Technology", announced that it will premier its complete line of AOI and SPI systems at APEX 2010.

MIRTEC Corp

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2015

Industry News | 2015-01-21 21:05:20.0

MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #2333 at the 2015 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 24–26, 2015 at the San Diego Convention Center.

MIRTEC Corp

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