Industry News: pbfree bga leaded paste (Page 1 of 35)

Stencils Optimise Paste Release

Industry News | 2003-03-21 08:12:24.0

Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.

SMTnet

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Industry News | 2018-02-19 13:55:53.0

IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.

Association Connecting Electronics Industries (IPC)

SMTA Announces Lead-Free Soldering Technology Symposium Schedule at SMTA International

Industry News | 2013-08-01 13:16:42.0

The SMTA announced that the Lead-Free Soldering Technology Symposium will be held on October 17, 2013 as a focused symposium at SMTA International in Fort Worth, TX.

Surface Mount Technology Association (SMTA)

Lead-Free (Pb-Free) Solder and Composition

Industry News | 2018-12-08 03:38:44.0

Lead-Free (Pb-Free) Solder and Composition

Flason Electronic Co.,limited

Donald Tyler, Corfin, to Present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip” at the SMTA Capital Chapter Meeting March 17th

Industry News | 2015-03-11 18:05:46.0

The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.

Surface Mount Technology Association (SMTA)

Update of IPC J-STD-609 Provides Greater Delineation of Lead-free Solders for Marking and Labeling

Industry News | 2010-04-10 02:05:54.0

IPC released today the A revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling, and now provides additional codes for the more precise specification of certain lead-free solders.

Association Connecting Electronics Industries (IPC)

The SMTA Capital Chapter to Host First Meeting of the Year on March 17th at EIT

Industry News | 2015-02-04 18:05:58.0

he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.

Surface Mount Technology Association (SMTA)

SMTA China Announces 2012 Paper/Presentation Awards

Industry News | 2012-05-09 13:57:33.0

SMTA China announced the Best and Excellent Paper and the Best and Excellent Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China Annual Breakfast Reception and Recognition Ceremony,

Surface Mount Technology Association (SMTA)

Seven IPC APEX EXPO™ Technical Conference Sessions Go Global - Live From Las Vegas

Industry News | 2011-01-20 13:45:14.0

IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.

Association Connecting Electronics Industries (IPC)

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