Industry News | 2003-05-22 08:54:17.0
Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2018-05-06 18:10:24.0
The SMTA Capital Chapter is excited to host a Chapter Meeting on May 15th from 5:00PM to 7:30PM at EIT, Leesburg, VA. IPC-Association Connecting Electronics Industries® has released the G revisions of the two most widely used standards in the electronic industry and who better to present “What’s New in IPC J-STD-001G and IPC-A-610G” than William Graver, Senior Analyst and Master IPC Trainer.
Industry News | 2013-11-26 14:46:08.0
The 2013 International Wafer-Level Packaging Conference (IWLPC), organized by SMTA and Chip Scale Review magazine, celebrated its 10th consecutive annual event on November 5-7, 2013 with a very successful conference and exhibition. Technical presentations covered a large range of applications, challenges, and solutions. This 10th anniversary event with over six hundred total participants had thirty-nine presentations in three parallel tracks over the two days.
Industry News | 2018-12-08 03:27:35.0
Printed Circuit Board (PCB) for Surface Mount Technology (SMT)
Industry News | 2002-02-26 11:16:24.0
The cost of conversion of a printed circuit assembly (PCA) is the difference between the selling price and the purchase order cost of material.
Industry News | 2001-10-30 08:36:48.0
Cost of Conversion Benchmarking Study Report CC-2001
Industry News | 2002-02-07 08:56:09.0
PCA Cost of Conversion Update
Industry News | 2002-02-13 12:57:01.0
Read the CEERIS Article in February 2002 issue of "SMT Magazine"
Industry News | 2014-01-10 09:40:28.0
STI Electronics, Inc. has introduced its new J-STD-001 Inspection Kit (part number STI-INSP-001-E1).
