Industry News | 2016-07-30 19:34:22.0
Nordson DAGE and Nordson MATRIX, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Stand 1H20 at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Centre. Nordson DAGE will showcase its new 4th generation, ultra-high resolution, off-line MXI X-ray system – the Quadra™ 7 and 4000Plus Bondtester. Nordson MATRIX will showcase its high-speed X3 Inline AXI system.
Industry News | 2016-09-22 18:12:16.0
Saki Corporation will demonstrate its BF-3Di-Z1 3D AOI system for extra-large (686x870mm) PCBs and easy-to-program real-time software in booth 726 at SMTA International, September 27 and 28th, 2016, being held at the Donald Stephens Convention Center, Rosemont, IL. Saki's 3D AOI systems measure heights from 0-20mm with 1µm resolution, measure the surface of surface mount devices and through-hole packages from all four directions without a dead angle or shadowing, and achieve full automation with very low false calls and zero escapes.
Industry News | 2018-01-24 22:13:50.0
Kurtz Ersa North America today announced plans to exhibit in Booth #1337 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The Ersa team will highlight a lineup of advanced reflow, selective solder and rework equipment, including its VERSAPRINT 2 Ultra stencil printer, VERSAFLEX-Ultra selective solder module and IR/PL 650 XL rework system.
Industry News | 2020-01-06 16:56:19.0
Inovaxe will exhibit at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. The company will showcase its new InoBar and MODI integration in Booth #1007.
Industry News | 2020-04-23 11:07:52.0
Essemtec announces that its FOX2 smart-sized modular pick-and-place technology is expandable in any direction. The new FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.
Industry News | 2021-07-27 15:48:50.0
BTU International, Inc. today announced plans to exhibit at NEPCON South China, scheduled to take place Aug. 25-27, 2021 at the Shenzhen International Convention & Exhibition Center, booth number 1P45. BTU will showcase the new Valence 3508 selective soldering system and PYRAMAX™ Vacuum Reflow Oven.
Industry News | 2021-11-01 18:00:38.0
Valence 3508 features an electromagnetic solder pump, unmatched thermal capability, rapid programming, and simplistic elegance in operation.
Industry News | 2009-03-17 09:35:12.0
Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will premier SP150 screen/stencil printer In booth 2225 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Industry News | 2013-02-26 09:31:57.0
Hover-Davis announces expansion of AdoptSMT Europe GmbH sales and support distribution adding the countries of Austria and Switzerland to its territory that already includes the UK, Ireland, Czech Republic, Slovakia, Hungary, Romania, Slovenia, Croatia, Serbia, Bosnia, Macedonia, Greece and Malta.
Industry News | 2016-09-21 15:33:30.0
Nordson MARCH introduces its Plasma Confinement Ring for wafer processing and wafer fan-out applications. The ring concentrates and focuses the plasma directly over the wafer to speed up the etching process, provide uniform plasma coverage, and to isolate the plasma on the wafer itself rather than the area around or below it. Process temperatures can be kept low because the ring increases etch rate capability without the need to increase the electrode temperature or add bias to the chuck.
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