Industry News | 2016-09-23 15:57:20.0
ViTrox Technologies is pleased to announce that its advanced optical inspection systems (AOI) will be presented at the coming productronica India by its strategic channel partners (SCP), Kyoritsu and iNEtest! The show takes place Sept. 21-23, 2016 at the Bangalore International Exhibition Centre. Both of the booths are located in Hall 3, Kyoritsu (#3141) and iNEtest (#3147). Highlights of the day will include the V510i 3D AOI and V510i G2S!
Industry News | 2015-01-22 17:50:50.0
ViTrox Technologies will exhibit in Booth #201 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. ViTrox will debut the new V810 S2 EX 3D In-line AXI and demonstrate the V510 Optimus 3D AOI. Additionally, ViTrox will launch new VVTS (ViTrox Verification Tool Solution) and VDSPC SPC Tools that are compatible with 5DX and Intelligent Link.
Industry News | 2015-02-25 14:32:37.0
ViTrox Technologies, announces that it has been awarded two 2015 NPI Awards in the categories of Test & Inspection – AOI and AXI for its V810 S2 EX In-Line AXI and V510 Optimus 3D AOI. The awards were presented to the company during a Tuesday, Feb. 24, 2015 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO. The addition of the two awards bring ViTrox to a total of 10 industry awards for its AXI and AOI capabilities.
Industry News | 2015-03-16 18:51:36.0
ViTrox Technologies today announced that it will exhibit in stand B1G58 at NEPCON China 2015, scheduled to take place April 21-23, 2015 at the Shanghai World EXPO Exhibition & Convention Center. The company will showcase the V810 S2 EX 3D In-line Advanced X-ray Inspection System (AXI) and V510 Optimus 3D AOI system, both of which are 2015 NPI Award winners. The V510 Optimus also won a 2014 Global Technology Award.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Industry News | 2010-05-11 14:43:51.0
Saint-Egrève, France - Vi TECHNOLOGY is pleased to be hosted by Fraunhofer-Institut in the Stand Production line «Future Packaging», booth 6-43 to demonstrates its 5K Series at SMT/HYBRID/PACKAGING 2010. More VIT equipment will also be presented at our agent’s booth 7-219, SmartTech to demonstrate solutions reducing defective PCBAs.
Industry News | 2011-03-31 10:55:15.0
Data I/O Corporation announces that it completed a sales representative agreement with Century Automation.
Industry News | 2017-01-05 04:27:37.0
BGA Inspection & Defect Photo Album (Can be downloaded) The photo CD-ROM album featuring over 280 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The disk includes examples of the following:
Industry News | 2021-09-14 02:08:49.0
In this article, I will talk about Top 10 Common Mistakes in PCB and PCBA Developing when makers/ startups/ engineers design a new electronics hardware products.
Industry News | 2016-09-23 15:41:59.0
Akrometrix today announced that Ryan Curry, Technical Account Manager, will co-present a paper with Don Adams, Manufacturing Engineering Manager at Bose Corporation, during SMTA International. The presentation, “Understanding PCB Design and Material Warpage Challenges Which Occur during B2B/Module-Carrier Attachment,” is scheduled to take place during session APT7, “Package and PCB Interactions,” on Wednesday, September 28th at 4 p.m.
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