Industry News | 2011-12-07 20:56:54.0
Innovations and best practices will be featured in the IPC Designers Forum and design-focused courses at IPC APEX EXPO 2012, February 26-March 1, at the San Diego Convention Center.
Industry News | 2018-10-18 11:21:46.0
Designing a Multilayer PCB Layout
Industry News | 2014-04-30 13:42:31.0
Indium Corporation's Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
Industry News | 2018-10-18 11:15:12.0
PCB Design and Layout Guidelines
Industry News | 2005-01-18 04:25:22.0
Technology Seminars from Premier EDA Solutions
Industry News | 2014-07-09 10:22:05.0
Indium Corporation recently released RMA-155 Pb-Free Solder Paste. RMA-155 is the best solder paste for customers who are required to use RMA materials, but who need the performance benefits of modern Pb-free solder paste technology.
Industry News | 2016-08-22 19:29:16.0
Libra Industries will present during the PCB West Conference, scheduled to take place September 13-16, 2016 at the Santa Clara Convention Center in CA. Fillebrown will present “Design for Assembly” on Wednesday, September 14 during the morning session.
Industry News | 2014-06-12 11:12:47.0
Mentor Graphics Launches Xpedition Path Finder Suite for Efficient IC/Package/PCB Design Optimization, Assembly, and Visualization
Industry News | 2018-03-07 07:37:28.0
Nordson MARCH announces that it has received a 2018 New Product Introduction (NPI) award in the Surface Treatment category for its new-generation RollVIA™ plasma system. The system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during printed circuit board (PCB) production. The RollVIA provides uniform plasma treatment of substrates as thin as 25 microns.
Industry News | 2018-05-31 10:23:37.0
Nordson MARCH announces that it has received the VISION Award from SMT China magazine and the Innovation Award from Electronics Manufacturing (EM) Asia magazine for its new-generation RollVIA™ plasma system. The awards were presented at NEPCON China, held in the Shanghai EXPO World Center, Shanghai, China, on April 24 and 25, 2018. The RollVIA™ plasma system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during printed circuit board (PCB) production. The RollVIA provides uniform plasma treatment of substrates as thin as 25 microns.
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