Industry News: pcb solder thickness (Page 8 of 285)

MIRTEC To Premier Its Technologically Advanced Automated Optical Inspection Systems at SMTAI 2011

Industry News | 2011-09-19 16:37:06.0

MIRTEC, “The Global Leader in Inspection Technology,” announces that it will premier its complete line of AOI systems in Booth #124 at SMTA International 2011.

MIRTEC Corp

MIRTEC TO PREMIER NEW 3D AOI, SPI AND LED INSPECTION SYSTEMS DURING NEPCON CHINA 2013

Industry News | 2013-04-17 11:18:13.0

MIRTEC Co., Ltd. today announced that it will premier its complete line of 3D AOI, SPI and LED inspection systems in Booth #1G68 at NEPCON China 2013, scheduled to take place April 23-25, 2013 at the Shanghai World EXPO Exhibition & Convention Center.

MIRTEC Corp

MIRTEC RECEIVES 18th INDUSTRY AWARD AT NEPCON SHANGHAI

Industry News | 2013-04-25 11:34:59.0

MIRTEC, announces that it has been awarded a 2013 EM Asia Innovation Award in the category of Test & Measurement/Inspection Systems – AOI for its MV-9 2D/3D CoaXPress In-Line AOI Series.

MIRTEC Corp

NEW 3D AOI, SPI AND LED INSPECTION SYSTEMS FROM MIRTEC TO BE DISPLAYED DURING NEPCON SOUTH CHINA 2013

Industry News | 2013-07-29 13:51:15.0

MIRTEC Co., Ltd. “The Global Leader in Inspection Technology,” today announced that it will premier its complete line of 3D AOI, SPI and LED inspection systems in Booth # A-1E45 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China.

MIRTEC Corp

MIRTEC to Premier Its Complete Line of Automated Optical Inspection Systems at APEX 2009

Industry News | 2009-03-16 18:07:28.0

OXFORD, CT � March 2009 � MIRTEC, �The Global Leader in Inspection Technology,� announces that it will introduce the latest advancements to its MV Series of AOI systems as well as unveil the company's first In-Line SPI System, the MIRTEC MS-11, in booth 147 at the upcoming APEX exhibition & conference scheduled to take place March 31- April 2, 2009 in Las Vegas.

MIRTEC Corp

MIRTEC Europe to Exhibit at SMT/Hybrid/Packaging 2017

Industry News | 2017-04-22 12:38:58.0

MIRTEC, “The Global Leader in Inspection Technology,” today announced they will display their award-winning 3D AOI and SPI Inspection Systems in pb tec’s booth, in Hall 4A, Stand 140 at the upcoming SMT/Hybrid/Packaging Show, scheduled to take place May 16-18 at the Messe in Nuremberg, Germany.

MIRTEC Corp

Altium CAM System and Free ODB++ Viewer Bridge Gap Between PCB Design and Manufacture

Industry News | 2003-03-11 08:45:00.0

CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.

SMTnet

Desktop Systems Provide Flexible Bonding

Industry News | 2003-06-10 08:39:25.0

New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.

SMTnet

MIRTEC to Display Award-Winning 3D AOI and SPI Solutions at APEX 2023

Industry News | 2022-12-14 12:21:04.0

MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1841 at the 2023 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Jan. 24-26, 2023, at the San Diego Convention Center in California.

MIRTEC Corp

MIRTEC GmbH to Have a Strong Presence at SMTConnect 2023 with 5 Inspection Systems on Display

Industry News | 2023-04-11 09:52:04.0

MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. The company will showcase a total of five (5) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry in Hall 4A, Stand 128.

MIRTEC Corp


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