Industry News: pcb voids in holes[0] (Page 1 of 2)

SQC in Electronics Manufacturing

Industry News | 2003-06-10 08:16:44.0

The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.

SMTnet

New IPC-9708 Standard Fills the Void in Test Methods for Pad Cratering

Industry News | 2011-03-31 11:54:23.0

Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.

Association Connecting Electronics Industries (IPC)

Come. Focus. Participate in the industry's best conference. The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference.

Industry News | 2010-05-07 16:01:14.0

New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.

Surface Mount Technology Association (SMTA)

Ersa to Present on Void Reduction in Reflow Soldering during SMTAI

Industry News | 2016-09-07 19:04:13.0

Kurtz Ersa North America is pleased to announce that Viktoria Rawinski, Assistant to the CEO of the Kurtz Ersa Group and head of the Kurtz Ersa Company Museum and the Corporate History Department, will present the paper entitled, “Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate – Process Integration in Industrial Production,” during SMTA International. The presentation is scheduled to take place during Session MFX4, entitled, “Reflow and Soldering Technology: Void Reduction” on Wednesday, September 28, 2016 from 10:30 a.m. to 12 p.m. in Room 49.

kurtz ersa Corporation

Indium Corporation’s Insight on Solder Preforms to Reduce Voiding in Bottom Termination Components

Industry News | 2015-10-30 15:33:26.0

Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.

Indium Corporation

SHENMAO America to Participate in the eSMART Factory Conference

Industry News | 2018-05-20 18:31:27.0

SHENMAO America today announced plans to exhibit at the eSMART Factory Conference, jointly organized by Global SMT & Packaging magazine and the SMTA, on Thursday, May 24, 2018 at the Plug ‘n Play Tech Center in Sunnyvale, CA. SHENMAO will highlight the new PF606-P245 Lead-free Zero Halogen Solder Paste. PF606-P245 paste improves ICT testability by completely removing flux to prevent contamination of test pins during test operation.

Shenmao Technology Inc.

Indium Corporation Features Heat-Spring® for LED Manufacturing at Strategies in Light

Industry News | 2016-02-11 22:57:15.0

Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara, Calif.

Indium Corporation

Seika Machinery to Host Third Webinar in Process Control Series: "Starting the SMT Process with a Clean PCB"

Industry News | 2024-09-23 20:18:21.0

Seika Machinery, Inc. is set to host the third session in its popular Process Control Webinar series, titled "Starting the SMT Process with a Clean PCB". This highly anticipated webinar will take place on Wednesday, October 2, 2024 at 10 a.m. PST and will be presented by Charlie Fujikawa, Senior Engineering Manager at Seika Machinery.

Seika Machinery, Inc.

Viscom Inspection Technologies Demonstrated at productronica in Munich

Industry News | 2021-10-14 13:49:10.0

Viscom AG is presenting its latest inspection systems and solutions for the widest possible range of the electronics industry's testing requirements at this year's productronica. The company's experts will be on Stand A2.177 to explain to visitors how ultra-precise defect detection, exact measurements and intelligent evaluation during manufacture blend seamlessly together into perfect and sustainable inspection processes.

Viscom AG

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