Industry News: pcb warpage during reflow soldring (Page 1 of 2)

SHENMAO to exhibit new pastes at SMTAI SHENMAO pastes reduce peak reflow temperature, energy consumption, and warpage of PCBs and components

Industry News | 2018-09-18 20:19:23.0

SHENMAO America, Inc. is pleased to announce plans to exhibit in booth 233 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon. During the two-day expo, the company will showcase its PQ10 low-temperature solder paste and PF606-P245 new generation lead-free zero halogen solder paste.

Shenmao Technology Inc.

Understanding PCB Design & Material Warpage Challenges – Learn More at SMTAI

Industry News | 2016-09-23 15:41:59.0

Akrometrix today announced that Ryan Curry, Technical Account Manager, will co-present a paper with Don Adams, Manufacturing Engineering Manager at Bose Corporation, during SMTA International. The presentation, “Understanding PCB Design and Material Warpage Challenges Which Occur during B2B/Module-Carrier Attachment,” is scheduled to take place during session APT7, “Package and PCB Interactions,” on Wednesday, September 28th at 4 p.m.

Akrometrix

Akrometrix Announces New Schedule for Technical Presentations

Industry News | 2016-09-22 17:49:37.0

Akrometrix today announced its upcoming schedule for technical presentations:

Akrometrix

Akrometrix Announces Automated Die Attach Tilt Metrology

Industry News | 2016-02-25 08:45:46.0

Akrometrix today announced that it has developed an automated die-board (or daughter-mother board) attach tilt metrology. All Akrometrix shadow moiré or DFP systems (AXPs) can be upgraded with the new feature.

Akrometrix

Akrometrix LLC Will Discuss Thermal Warpage and Strain Metrology at APEX

Industry News | 2016-02-17 16:31:00.0

Akrometrix LLC will exhibit in Booth #1623 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Company representatives will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

PAC Global to Discuss Thermal Warpage and Strain Metrology Solutions from Akrometrix at Upcoming SMTA Expos

Industry News | 2016-02-18 19:59:51.0

Akrometrix will exhibit at the SMTA Houston & Dallas Expo & Tech Forums in Texas. SMTA Houston is scheduled to take place Tuesday, March 1, 2016 at the Stafford Centre and SMTA Dallas is scheduled to take place Thursday, March 3, 2016 at the Plano Centre. The PAC Global team will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. PAC Global also will demonstrate the new Akrometrix Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

SHENMAO Awarded for New Low Temperature Solder at productronica

Industry News | 2019-11-13 11:33:38.0

SHENMAO America, Inc. announces that it was awarded a 2019 Global Technology Award in the category of Solder Paste for its PF735-PQ10 Low Temperature Solder (LTS). The award was presented to the company during a Tuesday, Nov. 12, 2019 ceremony that took place during productronica in Munich, Germany.

Shenmao Technology Inc.

SHENMAO Picks up Award for New Low Temperature Solder at SMTA Guadalajara

Industry News | 2019-10-24 16:29:44.0

SHENMAO America, Inc. announces that it was awarded a 2019 Mexico Technology Award in the category of Solder Paste for its PF735-PQ10 Low Temperature Solder (LTS). The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.

Shenmao Technology Inc.

SMART Group to Present Advanced PoP Webinar

Industry News | 2012-02-15 19:16:37.0

SMART Group will host a Webinar titled “Package on Package (PoP) Assembly Process & Inspection” on Thursday March 15, 2012 from 2:30-3:30 p.m. GMT.

The SMART Group

Hanwha Techwin Wins FOUR Mexico Technology Awards

Industry News | 2021-11-22 08:29:07.0

Hanwha Techwin Automation Americas is pleased to announce that it received four 2021 Mexico Technology Awards in the categories of Component Placement – High Volume and LED Placement Equipment for the HM520h Hybrid LED Mounter, and in the categories of LED Printing Equipment and Printers for its Hanwha/ESE US-2000DXH1 Screen Printer. The awards were announced during a ceremony that took place Tuesday, Nov. 2, 2021 during SMTA International in Minneapolis, MN.

Hanwha Techwin CO., LTD.

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