Industry News | 2024-09-16 19:59:33.0
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC's Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, "Advanced Packaging to Board Level Integration--Needs and Challenges."
Industry News | 2016-04-20 18:15:34.0
Nordson ASYMTEK will present a triple-valve, closed-loop system to jet conformal coating, a UV oven to cure it, and an automated coating inspection system to verify the coating results at the SMT Hybrid Packaging Show in Nuremberg, Germany, in the smartTec stand 7-109 from 26-28 April 2016. Nordson ASYMTEK's award-winning Quantum® Q-6800 high-performance, large-format dispensing system will jet underfill as part of the show's Future Packaging Line at stand 6-434.
Industry News | 2010-09-07 11:18:39.0
SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with the SMTA China 5th Anniversary Keynote Breakfast Reception, which took place September 1, 2010 at the Futian Shangri-la, Shenzhen Hotel.
Industry News | 2020-02-18 14:31:52.0
Join us for High Reliability Forum as a presenter or instructor and share your expertise in electronics with high reliability requirements.
Industry News | 2024-10-13 18:41:25.0
New white paper serves as a blueprint for strengthening PCB assembly capabilities in the United States
Industry News | 2016-08-17 21:07:09.0
Nordson ASYMTEK will present the paper Advanced Dispense Solutions for Hand-held Devices, at China Mobile Manufacture Forum (CMMF) on August 25, 2016. In addition, they will be exhibiting the latest in jet dispensing and conformal coating technologies in booth #1H20 at NEPCON South China, August 30-September 1, 2016 at the Shenzhen Convention & Exhibition Center, Shenzhen, China.
Industry News | 2016-03-09 16:11:24.0
Presenting "A Review of Jetting Technologies for Fluid Dispensing: Identifying the Features that Influence Productivity" on March 17, 2016, at 10:30 AM.
Industry News | 2018-12-08 03:27:35.0
Printed Circuit Board (PCB) for Surface Mount Technology (SMT)
Industry News | 2021-12-17 16:28:07.0
See equipment and talk to experts about the latest in fluid dispensing, test, inspection, and plasma treatment in one booth, #I2716
Industry News | 2021-12-20 04:12:01.0
2021 China South China SMT Academic and Applied Technology Seminar and China SMT Innovation Achievement Award Ceremony was held in Shenzhen on December 10. In order to build a good communication platform for SMT enterprises in South China and create opportunities for technical exchange, the SMT Academic and Application Technology annual meeting in South China is held every December by the SMT Special Committee of Guangdong Electronics Society. This annual meeting invited industry experts to explain the innovation direction of intelligent manufacturing SMT technology and SiP packaging, from PCBA to micro assembly, to solve the hot issues of high-density, thin and miniaturization of electronic products, especially mobile terminal electronic products in recent years.
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