Industry News | 2016-09-08 13:16:47.0
PDR Americas today announces its latest upgrade – the new ThermoActive Suite Plus ‘dynamic profile software,’ signaling a new era in rework process control. PDR’s recently released advanced state-of-the-art smart algorithms and high-speed processing capability ensures the most exacting rework process control in the industry.
Industry News | 2012-11-26 14:09:09.0
Macrotron Systems announces availability of its MacroVault OEM/ODM USB 3.0 flash drive solutions.
Industry News | 2012-03-24 10:06:28.0
NEPCON China Becomes a Platform for the Debut of New Product Releases in Asia
Industry News | 2010-04-11 01:50:44.0
BURNSVILLE, MN - Vapor Works, a division of R&D Technical Services Inc., announces that it has been awarded an NPI Award in the category of Rework and Repair Tools for its newly updated V-Works Vapor Phase Rework Station. The award was presented to the company during a Tuesday, April 6, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas during APEX 2010.
Industry News | 2021-01-17 17:50:26.0
The Assembly Division of MacDermid Alpha Electronics Solutions announces the release of ALPHA HiTechUnderfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.
Industry News | 2021-10-07 15:36:40.0
VJ Electronix, Inc. will exhibit in Booth #3218 at the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. The company plans to demonstrate their XQuik III, a competitively priced, high-end x-ray counting system for electronic components with a cycle time of
Industry News | 2013-02-25 14:22:39.0
Company receives award for the first electrical + optical First Article verification system.
Industry News | 2022-08-14 14:06:55.0
STI Electronics, Inc. announces it will present "Advanced SMT Workshop, A Comprehensive Review of the SMT Electronics Assembly Process." The four-day workshop will be held October 10-13, 2022 and consists of four classes for the electronics industry.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
Industry News | 2009-12-07 20:44:54.0
At the Productronica 2009 tradeshow in Munich, Finetech will introduce its upcoming entry-level rework system, the FINEPLACER® core.
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