Industry News: peel strength (Page 1 of 2)

IPC Honors Best Papers at IPC APEX EXPO� 2009

Industry News | 2009-04-15 23:01:13.0

BANNOCKBURN, Ill., USA, April 2, 2009 � IPC � IPC � Association Connecting Electronics Industries� has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO, held March 31�April 2, 2009 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.

Association Connecting Electronics Industries (IPC)

IPC Releases Additional Test Coupons for the IPC-2221B Gerber Coupon Generator Test Coupons provide structural integrity verification based on current printed board design technology

Industry News | 2018-05-22 12:19:27.0

IPC – Association Connecting Electronics Industries® would like to announce the release of additional test coupons for the IPC-2221B Gerber Coupon Generator, an exclusive annual subscription service for IPC member companies. The IPC-2221B Gerber Coupon Generator subscription service is the only service providing new, industry approved test coupons addressing blind, buried, stacked and staggered via structures. The most commonly used coupons for product acceptance are “AB,” “AB/R” and “D” which were introduced in 2016.

Association Connecting Electronics Industries (IPC)

Christopher Associates Now Provides Qualification Samples for Its Advanced Backsheet Material

Industry News | 2010-06-04 17:17:16.0

Christopher Associates Inc. announces that it now ships qualification samples of the Jolywood FFC-JW30 advanced photovoltaic backsheet material. Using patented technology, Jolywood has achieved a breakthrough in environmental resistance and electrical performance.

Christopher Associates Inc.

New Henkel Electrically Conductive Adhesive Cures Fast at Low Temperature; Ideal for Photovoltaic, Automotive and Membrane Switch Applications

Industry News | 2010-05-12 13:12:33.0

Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.

Henkel Electronic Materials

Christopher Associates/Beijing Tonsan Adhesive Co. Ltd. to Present Evaluation of Sealants used in Photovoltaic Module Manufacture at AIMS/Harsh Environments Symposium at SMTAI 2010

Industry News | 2010-09-26 15:48:56.0

Christopher Associates/Beijing Tonsan Adhesive Co. Ltd. announces that Jasbir Bath will present a paper titled “An Evaluation of Sealants used in Photovoltaic (PV) Module Manufacture” at the upcoming AIMS/Harsh Environments Symposium at the SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Christopher Associates Inc.

Henkel Product Development Expertise Rewarded at APEX

Industry News | 2010-04-16 01:50:52.0

Building on a rich history of industry honors and product accolades, Henkel Corporation was once again recognized for its innovation initiatives at the recent APEX event in Las Vegas, Nevada. Two of the company’s most recent product advances, Loctite PowerstrateXtreme Printable (PSX-P) and Hysol ECCOBOND CA3556HF, were at the top of the leaderboard for two well-established honors programs.

Henkel Electronic Materials

MacDermid Alpha Presents 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at SNEC 2021 in Shanghai, China

Industry News | 2021-05-21 03:59:59.0

The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting a technical paper: 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at the SNEC 15th(2021) International Photovoltaic Power Generation and Smart Energy Conference &Exhibitiontaking placein Shanghai, China on June 2-5,2021.

MacDermid Alpha Electronics Solutions

Engineered Conductive Materials to Exhibit DB-1541-X Series Adhesives at SNEC 2011

Industry News | 2011-01-17 19:42:26.0

Engineered Conductive Materials, LLC, will showcase its DB-1541-X Series Conductive Stringer Attach Adhesives in Hall E7, Stand 655 at the upcoming SNEC International Photovoltaic Power Generation Conference & Exhibition, scheduled to take place February 22-24, 2011 at the Shanghai New International Expo Center in Shanghai, China.

Engineered Conductive Materials, LLC

Engineered Conductive Materials to Exhibit DB-1541-X Series Adhesives at Intersolar Europe 2011

Industry News | 2011-03-31 11:05:40.0

Engineered Conductive Materials, LLC will showcase its DB-1541-X Series Conductive Stringer Attach Adhesives in Hall A5, Stand 653 at the upcoming Intersolar Europe, scheduled to take place June 8-10, 2011 at the New Munich Trade Faire Centre in Munich, Germany.

Engineered Conductive Materials, LLC

New Low-Temperature Curing Conductive Adhesive Available for OLEDs and OPVs

Industry News | 2012-04-05 13:59:12.0

Engineered Conductive Materials introduces the low-temperature curing Conductive Adhesive DB-1541-LTC for use in organic light emitting diodes (OLED) and organic photovoltaics (OPV).

ECM Equipment Sales, Inc.

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