Industry News: peeling of (Page 1 of 1)

Nordson ASYMTEK Introduces Panorama™ Conformal Coating Line Solutions to Fit a Range of Production Processes

Industry News | 2019-10-02 16:32:48.0

Nordson ASYMTEK is pleased to introduce its Panorama™ conformal coating line solutions, providing a balance of equipment and process control for optimal efficiency in automated conformal coating.

ASYMTEK Products | Nordson Electronics Solutions

The System of X-ray Radiography Non-destructive Testing technology

Industry News | 2021-11-30 01:54:12.0

After more than 100 years of development, X-ray imaging technology has formed a relatively complete X-ray non-destructive testing (NDT) technology system. In order to meet these needs, new detection technologies are constantly innovating, using Xray inline inspection technology. It can not only detect invisible crack or porosity such as aluminum casting , but also qualitatively and quantitatively analyze the detection results to find flaws early.

Unicomp Technology Co., Ltd

Polyonics Adds New Double-Coated Polyimide Options to its Family of High Temperature Engineered Tapes

Industry News | 2012-02-10 15:56:15.0

The new Polyonics double-coated tapes are ideal for bonding materials that will be exposed to extremly high temperatures and harsh manufacturing environments. They include liners that are designed to be die cut and, due to their additional stiffness compared to transfer adhesives, can be easily auto-applied.

Polyonics, Inc.

Broad Portfolio of Henkel Enabling Technologies on Show at SMTA International 2016

Industry News | 2016-09-21 15:44:21.0

From booth #936 at the upcoming SMTA International event in Rosemont, Illinois, Henkel Adhesive Electronics’ display will underscore why the company leads the market in comprehensive assembly materials technologies. With multi-award-winning LOCTITE GC solder materials, a broad range of leading-edge thermal management technologies, and new applications for TECHNOMELT products, the Henkel booth is the go-to destination for advanced electronics assembly materials.

Henkel Electronic Materials

MacDermid Alpha Presents 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at SNEC 2021 in Shanghai, China

Industry News | 2021-05-21 03:59:59.0

The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting a technical paper: 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at the SNEC 15th(2021) International Photovoltaic Power Generation and Smart Energy Conference &Exhibitiontaking placein Shanghai, China on June 2-5,2021.

MacDermid Alpha Electronics Solutions

MacDermid Alpha Announces Release of STAYDRY® H2-3000PSA: Hydrogen & Moisture Getter Film

Industry News | 2021-01-30 07:00:01.0

MacDermid Alpha Electronics Solutions announces the release of STAYDRY® H2-3000PSA, a hydrogen and moisture getter for hermetic packages. STAYDRY H2-3000PSA adds a newly developed proprietary adhesive that meets rigid outgassing and adhesion testing for aerospace, telecom and medical applications, meeting Mil-STD-883K, Method 5011.6 and NASA ASTM E595 requirements.

MacDermid Alpha Electronics Solutions

Christopher Associates/Beijing Tonsan Adhesive Co. Ltd. to Present Evaluation of Sealants used in Photovoltaic Module Manufacture at AIMS/Harsh Environments Symposium at SMTAI 2010

Industry News | 2010-09-26 15:48:56.0

Christopher Associates/Beijing Tonsan Adhesive Co. Ltd. announces that Jasbir Bath will present a paper titled “An Evaluation of Sealants used in Photovoltaic (PV) Module Manufacture” at the upcoming AIMS/Harsh Environments Symposium at the SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Christopher Associates Inc.

UVLED application burst buffer period, the urgent matter of the moment is to start the technical war

Industry News | 2019-12-16 22:05:41.0

In recent years, as a subdivision of the LED industry, UV LED industry has developed in full swing. In 2019, the UV LED industry is in the buffer phase of application explosion, and the most urgent task for relevant companies is to launch the technology war, in order to capture as many places as possible before the real market explosion.

Beijing Technology Company

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