Industry News: phoenix and package and analyzer (Page 5 of 6)

Nordson TEST & INSPECTION to Demonstrate High-Precision Inspection Solutions at SMTAI and SMT Guadalajara

Industry News | 2023-10-09 09:41:50.0

Nordson TEST & INSPECTION announces its participation in SMTAI and SMTA Guadalajara. The Company will showcase its state-of-the-art inspection and metrology solutions including the SQ3000™+ Multi-Function system for AOI, SPI and CMM, as well as the Quadra 7 Pro Manual X-ray Inspection (MXI) system in booth #1301 and #1305. The events will take place at the Minneapolis Convention Center from October 9th – 12th and from Wednesday, October 25th – 26th at the Expo Guadalajara in Mexico.

Nordson Corporation

CyberOptics to Present Technical Paper'Fast, 100% Wafer Bump Metrology and Inspection' at Virtual IEEE PAINE Conference

Industry News | 2020-11-18 15:38:26.0

CyberOptics® Corporation (NASDAQ: CYBE) will present at the Virtual IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) on December 16th at 8:00amCT.

CyberOptics Corporation

CyberOptics to Showcase High-Precision Inspection and Metrology Solutions at the SEMI Connecting Heterogeneous Systems Summit

Industry News | 2021-08-13 12:16:35.0

CyberOptics® Corporation (NASDAQ: CYBE) will feature the WX3000™ metrology and inspection system with MRS™ sensor technology, and high-precision sensors for semiconductor tool set-up and diagnostics at the VirtualConnecting Heterogeneous Systems Summit Sept. 1-3, 2021.

CyberOptics Corporation

Mentor Graphics Announces PADS PCB Product Creation Platform with Voltage Drop and Electronic Cooling Capabilities

Industry News | 2016-05-05 20:33:25.0

Mentor Graphics Corporation (NASDAQ: MENT) today announced a comprehensive product-creation platform based on PADS® PCB software that enables individual engineers and small teams to solve the engineering challenges involved in creating today’s electronic products. With increasing systems design complexity and the need for printed circuit board (PCB), mechanical and systems engineers to access easy-to-deploy tools, the PADS platform has been extended to enable engineers to develop PCB-based systems from concept through manufacturing hand-off.

Mentor Graphics

VJE’s Don Naugler and BEST’s Bob Wetterman to Present during Technical Session SMT3 at SMTA International 2013

Industry News | 2013-09-16 14:38:01.0

VJ Electronix, Inc. and BEST, Inc. announce that Don Naugler and Bob Wetterman will be presenting a paper during technical session SMT3 BGA Profiling and Reballing at the upcoming SMTA International in Fort Worth, TX.

VJ Electronix

Launch of NEPCON South China 2012 Features Eye-Catching Medical and Automotive Electronics Displays

Industry News | 2012-08-28 08:13:26.0

NEPCON South China 2012 kicked off today at the Shenzhen Convention & Exhibition Center.

Reed Exhibitions

CyberOptics to Present '100% Wafer Bump Metrology and Inspection' Technical Paper at the SEMICON Taiwan SiP Global Summit 2020

Industry News | 2020-09-06 04:37:56.0

CyberOptics® Corporation (NASDAQ: CYBE) will present at the SEMICON Taiwan Global SiP Summit on September 24, 2020 at 4:20pm. Tim Skunes, VP of R&D at CyberOptics, will share the technical presentation 'Fast, 100% 3D Wafer Bump Metrology and Inspection to Improve Yields and 3D System Integration'.

CyberOptics Corporation

Koh Young and Repstronics Hosting a Joint Webinar to Help Manufacturers Create Smarter Factories with AI-Powered Connected Solutions

Industry News | 2022-03-09 12:45:18.0

In cooperation with its Mexico Sales Partner Repstronics, Koh Young, the industry leader in True3D™ measurement-based inspection solutions, is hosting a FREE Spanish webinar to help customers create smarter factories with AI-powered inspection solutions. The online seminar will begin at 1:00PM EST on Wednesday, 23 March 2022. Given the expected attendance for this trending topic, pre-registration for the free webinar is required: https://repstronics.zohobackstage.com/KohYoungInspection

Koh Young America, Inc.

Akrometrix LLC to Demonstrate Real-Time Analysis, Array Generation (wafer partitioning), and 2D/3D Interface Analysis Software at productronica, U.S. Pavilion Hall A3, Booth 112/1

Industry News | 2015-10-22 16:56:59.0

Akrometrix LLC will exhibit in Hall A3, Booth 112/1 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Company representatives will exhibit Akrometric’s TherMoire’ AXP modular metrology platform which provides shadow moire’, digital fringe projection, and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

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