Industry News | 2011-09-19 18:10:56.0
The IPC Conference on Securing Intellectual Property Through Physical Security, IT and Regulatory Compliance will be held November 3-4, 2011, in Washington, D.C. The conference will examine an issue that’s getting increased attention from OEMs and the U.S. Department of Defense (DoD): the protection of intellectual property (IP) that is designed into printed circuit boards.
Industry News | 2010-06-04 16:23:16.0
BANNOCKBURN, Ill., USA — The IPC Solder Products Value Council (SPVC) has published a free white paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, that provides a set of test protocols for the evaluation of new lead-free alloys on the basis of their physical properties. Developed in cooperation with leading original equipment manufacturers (OEMs) and electronics manufacturing services (EMS) companies, the white paper will help the electronics assembly industry reduce the time and effort required to characterize an alloy and improve its processes without jeopardizing reliability.
Industry News | 2003-08-27 10:58:00.0
Lead free solders and embedded passives headline professional development schedule at the 2003 IPC Annual Meeting
Industry News | 2010-08-04 21:04:22.0
Manufacturing reliable and sustainable electronics that meet customer needs without failure during the product’s life cycle has been stymied by myriad challenges, from environmental regulations to new materials and processes. Bringing together the latest research by industry experts, IPC — Association Connecting Electronics Industries® will host a Technical Conference on Electronics Sustainability, September 28–30 at Electronics Midwest, in Rosemont, Ill. Electronics Midwest is produced jointly by IPC and Canon Communications.
Industry News | 2014-08-18 10:23:40.0
The IPC Solder Products Value Council (SPVC), in cooperation with iNEMI, has written a white paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, that helps users determine which alloy characteristics best match their requirements.
Industry News | 2012-03-26 15:58:58.0
Tin whisker growth, risk mitigation, detection and failure analysis will be the focus of the IPC Tin Whiskers Conference, April 17–19, 2012, in Ft. Worth, Texas.
Industry News | 2015-05-18 21:29:50.0
The SMTA Capital Chapter is pleased to announce its second meeting of 2015 on May 28th, scheduled from 5:30 pm to 8:00 pm at NTS Baltimore formerly Trace Labs, 5 North Park Drive, Hunt Valley, MD 21030. The focus of this chapter meeting will be “Failure Analysis Process for Printed Board Assemblies” presented by John M. Radman, Senior Applications Engineer, NTS Baltimore.
Industry News | 2021-04-29 16:54:35.0
Automatic identification and optimal inline monitoring with LiquiSonic®
Industry News | 2021-07-06 15:17:26.0
Realtime monitoring of scrubbing liquid concentration and salt content with LiquiSonic®
Industry News | 2021-04-09 02:12:31.0
The reaction between the plasma surface treatment machine and the surface of the material is both physical and chemical. Through the reaction, the surface of the material will become rough, and at the same time, the oxide can be reduced, making the surface of the material hydrophilic and cohesive. Dyeability, biocompatibility and electrical properties have been greatly improved.
