Industry News: pickup cross board (Page 9 of 27)

PACE to Showcase New TF Series of BGA Rework Systems at IPC APEX EXPO 2019

Industry News | 2019-01-22 16:00:09.0

At IPC Apex 2019, PACE Worldwide will showcase their new TF Series of BGA Rework Systems. The TF1800 is designed for standard board sizes of up to 12” x 12”, while the TF2800 is for extra large, high mass PCB’s up to 24” x 24”.

PACE Worldwide

Production Solutions to Showcase Complete Board Support Offerings at IPC APEX EXPO 2011

Industry News | 2011-03-11 16:49:04.0

Production Solutions Inc., manufacturer of the Red-E-Set Board Support, will showcase its full product line in Booth #351 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Production Solutions

P. D. Circuits to Exhibit at PCB West 2010

Industry News | 2010-08-24 09:40:31.0

P. D. Circuits, Inc., specializing in delivering the highest quality PCBs, technical support, and service to OEM and EMS companies worldwide, announces that it will exhibit at the upcoming PCB West Conference & Exhibition, scheduled to take place September 28-30, 2010 at the Santa Clara Convention Center in Santa Clara, CA.

NCAB Group USA

Elite Electronics Purchases Europlacer's iineo

Industry News | 2009-04-27 14:30:30.0

DORSET, UNITED KINGDOM - April 2009 - Blakell Europlacer Ltd., a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that Elite Electronics Systems has placed an order for the iineo.

EUROPLACER

Europlacer to Exhibit a Range of Innovative Solution at SMT China 2013

Industry News | 2013-03-26 20:43:50.0

Europlacer, will highlight the new ii-Feed, the multi award-winning iineo platform and the market-leading Speedprint SP710avi in booth #1C40 at the upcoming NEPCON China exhibition and conference, scheduled to take place April 23-25, 2013 at the Shanghai World Expo Exhibition & Convention Center in Shanghai.

EUROPLACER

Mentor Graphics Launches Xpedition Package Integrator Flow for IC-Package-Board Design

Industry News | 2015-03-23 12:27:07.0

Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® Package Integrator flow, the industry’s broadest solution for integrated circuit (IC), package, and printed circuit board (PCB) co-design and optimization. The Package Integrator solution automates planning, assembly and optimization of today’s complex multi-die packages. It incorporates a unique virtual die model concept for true IC-to-package co-optimization. In support of early marketing-level studies for a proposed new device, users can now plan, assemble and optimize complex systems with minimal source data. The new Package Integrator flow allows design teams to realize faster and more efficient physical path finding and seamless tool integration for rapid prototyping, right to the production flow.

Mentor Graphics

Visitors Wowed at SIPLACE SX Road Show

Industry News | 2009-10-15 08:43:05.0

Live Gantry Upgrade Demonstrations Prove SIPLACE Strength in Innovation

Siemens Process Industries and Drives

PACE Offers 10 Free Nozzles with the Purchase of New TF 1800 BGA Rework System

Industry News | 2016-10-26 14:55:50.0

Vass, NC – Sept 20, 2016 – PACE Worldwide announces an introductory promotion in conjunction with the launch of their new TF 1800 BGA/SMD Rework System, which began shipping in October. For a limited time, PACE will provide 10 Heat Focusing Nozzles free of charge with the purchase of each TF 1800 System, a value of over $3,400 (£2,700/€3,340).

PACE Worldwide

Saturn Electronics Corp. Invited to the Caribbean

Industry News | 2008-06-30 20:28:22.0

The Bare Board Manufacturer to present at PCB Assembly DR 2008

Saturn Electronics Corporation

P. D. Circuits Named on Business NH Magazine’s Top 100 Private Companies List

Industry News | 2011-09-14 11:46:09.0

P. D. Circuits has been named on Business NH Magazine’s Top 100 Private Companies list.

NCAB Group USA


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