Industry News | 2010-02-15 19:32:28.0
Rosenheim, Germany — February 2010 — Multitest, a designer and manufacturer of final test handlers and final test sockets used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that Valts Treibergs and Chris Cuda will present a paper titled “Spring Probe PCB Pad Wear Analysis” at the upcoming Burn-in & Test Socket Workshop, schedule to take place March 7-10, 2010 at the Hilton Phoenix East/Mesa Hotel in Mesa, Ariz.
Industry News | 2011-09-12 11:53:55.0
Nordson DAGE will highlight its latest bond testing and X-ray inspection capabilities in Booth #512 at the upcoming IMAPS 44th International Symposium on Microelectronics.
Industry News | 2011-10-16 00:05:15.0
Nordson DAGE will highlight its latest bond testing and X-ray inspection capabilities in Booth #326 at the upcoming International Symposium for Testing and Failure Analysis (ISTFA).
Industry News | 2012-06-11 12:36:11.0
Nordson DAGE, announces it will exhibit in Booth #5971 North at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.
Industry News | 2011-03-21 12:08:06.0
At Apex 2011 Expo in Las Vegas, Digitaltest Inc., a leader in electronic test hardware and software solutions for assembled printed circuit boards, will showcase its latest solutions in manufacturing and test technologies.
Industry News | 2008-12-15 15:28:33.0
LOS ALAMITOS, CA - December 2008 - With the wide acceptance of Amkor's FusionQuad� (VQFP/HVF-PQFP), Practical Components has added two new test boards to its lineup. FusionQuad� packages are leadframe-based plastic offering the effective integration of ExposedPad TQFP and MLF� technologies. FusionQuad� not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50 percent reduction in package size for a given leadcount.
Industry News | 2018-10-18 08:00:40.0
SMT solder joint quality and appearance inspection process
Industry News | 2018-10-18 08:01:00.0
SMT solder joint quality and appearance inspection process
Industry News | 2012-11-05 19:42:49.0
Mentor Graphics announced the availability of the next-generation PADS® flow with the introduction of PADS 9.5. This release adds usability enhancements, GUI improvements in DxDesigner®, interactive routing updates, and availability in Simplified Chinese language. The scalable PADS 9.5 flow enables users to cost-effectively design their products, from standard PCBs to the industry’s most complex, highest performance, and densest PCBs.
