Industry News: pin and to and pad (Page 3 of 11)

FCT Assembly to Display Advanced Solder Pastes and Stencil Technology at SMTAI 2009

Industry News | 2009-09-17 15:08:48.0

GREELEY, CO —FCT Assembly announces that it will debut four new solder pastes and showcase its breakthrough UltraSlic™ FG solder paste stencil in booth 417 at the upcoming SMTA International conference & exhibition, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.

FCT ASSEMBLY, INC.

Essemtec Announces Ability to Dispense Material and Place LEDs on Film Substrates

Industry News | 2008-05-18 01:34:26.0

Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it can perform material dispensing and consecutive placement of LEDs on film substrates.

ESSEMTEC AG

Intel and VJ Technologies to Present Pad Site Dress Methods at SMTAI 2010

Industry News | 2010-09-27 23:15:26.0

VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

VJ Electronix

JTAG Technologies - 25 Years of Innovation and Dedication to Boundary Scan

Industry News | 2018-10-27 16:12:01.0

This year (2018) JTAG Technologies are proud to celebrate their 25th year of developing, supplying and supporting world-class board (PCBA) test and programming solutions based on IEEE Std 1149.x .

JTAG Technologies B. V.

Pin-in-Paste Reflow Calculations and Special Cases

Industry News | 2018-10-18 08:43:30.0

Pin-in-Paste Reflow Calculations and Special Cases

Flason Electronic Co.,limited

Indium Corporation to Host PCB and Component Defects Webinar

Industry News | 2020-08-22 04:07:55.0

Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions on Wednesday, Sept. 9--5:30 a.m. Eastern Time (10:30 a.m. London Time, 5:30 p.m. Malaysia Time) and Noon Eastern Time (5 p.m. London Time, Midnight Malaysia Time).

Indium Corporation

Pickering Interfaces to Feature PXI and LXI Switching Solutions and Signal Routing Software at SEMICON West

Industry News | 2017-07-06 10:06:36.0

Pickering Interfaces will showcase their latest high-density PXI and Ethernet LXI Switching Solutions along with their Signal Routing Software at SEMICON West, booth 5162, on July 11-13, 2017 in San Francisco, CA. Below is a sampling of the products that will be highlighted at the show:

Pickering Interfaces Ltd.

What is SMT and where to by SMT spare parts

Industry News | 2017-08-17 06:55:03.0

what is SMT and where to by SMT spare parts

SMTPLAZA CO.,LTD

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:14:11.0

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Nordson DAGE's Senior Applications Engineer to Present at SMART Group BGA and Cleaning Reliability Conference

Industry News | 2011-10-03 17:04:22.0

Nordson DAGE announces that Kamran Iqbal will present “Measuring the Reliability Risk of PCB Pad Craters” at the SMART Group BGA and Cleaning Reliability Conference.

Nordson DAGE


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Selective soldering solutions with Jade soldering machine

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