Industry News | 2010-03-27 13:42:03.0
MINNEAPOLIS - CyberOptics Corporation (Nasdaq: CYBE) announces that it will introduce its newest SPI and AOI systems in booth 2271 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2014-05-22 11:36:25.0
Indium Corporation's Derrick Herron, technical support engineer, will serve as an expert presenter at ZESTRON’s Assembly, Cleaning, and Reliability Hands-on Workshop on June 10 in Franklin, Mass.
Industry News | 2011-03-11 15:37:02.0
Acculogic, Inc. announces that it will highlight its leading testing technologies in Booth #1435 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2018-03-11 11:24:23.0
Pickering Interfaces will showcase their broad catalogue of PXI, PCI, LXI, cabling products, and software solutions at AMPER 2018, 20-23 March 2018. These include the following products:
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2009-05-26 18:45:31.0
TORRANCE, CA � May 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will exhibit the Sawa SC-500GE portable cleaner, as well as product literature for all Seika products at the upcoming SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 11, 2009 at the Sheraton Bloomington Hotel in Bloomington, MN.
Industry News | 2009-09-18 09:44:06.0
September 2009 — The Balver Zinn Group announces that Cobar Solder Products will exhibit a complete range of advanced soldering materials ranging from bar solder to SMT solder paste to high-performance fluxes in booth 722 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2013-11-14 18:21:25.0
Indium Corporation's Sze Pei Lim, Technical Manager - Asia-Pacific Operations, and Sehar Samiappan, Area Technical Manager, will present at the IPC Conference on Assembly and Reliability November 20 in Bangkok, Thailand.
Industry News | 2018-10-15 18:31:07.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2018-10-18 19:55:33.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
