Industry News | 2003-03-13 08:19:18.0
The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.
Industry News | 2016-12-26 13:40:59.0
SMT Step Stencils provide increased control over your print process. Vary thickness in any area of your stencil to generate the exact paste volume and height for every single component. A perfect solution for Pin-in-Paste applications. For FREE Technical Assistance please call (760) 798-6984
Industry News | 2018-10-18 10:13:08.0
The Application of the Pin-in-Paste Reflow Process
Industry News | 2003-04-15 08:23:22.0
Metral TINT back panel receptacles are compatible with standard pin-in-paste SMT processes, eliminating costly secondary assembly operations including heat staking, wave soldering or press fitting.
Industry News | 2018-10-18 08:43:30.0
Pin-in-Paste Reflow Calculations and Special Cases
Industry News | 2015-10-27 22:08:05.0
Indium Corporation will feature void-reducing Indium8.9HF, a halogen-free, no-clean solder paste, at Productronica 2015, Nov. 10-13, in Munich, Germany.
Industry News | 2015-11-14 15:34:42.0
Indium Corporation presented its suite of void-reducing solder pastes, including halogen-free, no-clean Indium8.9HF, at Productronica 2015, Nov. 10-13, in Munich, Germany
Industry News | 2020-05-30 12:34:54.0
SHENMAO America, Inc. is pleased to introduce its new PF606-RT35 room temperature solder paste (RTS) that has been specially designed for SMT processes. Compared with common pastes, the no-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. With the wide reflow window, it even can be easily fit into the process of the most complicated PCB design.
Industry News | 2011-03-14 17:53:00.0
Christopher Associates announces that Jasbir Bath, Consulting Engineer, will Chair the session titled "Reflow Assembly" at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas. The session will take place Tuesday, April 12, 2011 from 1:30-3 p.m.
Industry News | 2016-02-06 01:03:23.0
Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo.
