Industry News: pink ring defects (Page 1 of 2)

Long-time IPC Volunteer, Patricia Goldman Inducted Into IPC Hall of Fame

Industry News | 2016-03-18 11:53:18.0

In recognition of her extraordinary contributions to IPC and the electronics industry, Patricia (Patty) Goldman, managing editor, I-Connect007, was honored with the IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO® at the Las Vegas Convention Center, the IPC Hall of Fame Award represents IPC's highest level of volunteer recognition.

Association Connecting Electronics Industries (IPC)

Mid-Atlantic Advanced Learning Session on Failure Analysis, Technical Presentations and Live Q&A Panel Discussion; September 7th – 10th

Industry News | 2021-08-13 12:58:35.0

The SMTA Capital Chapter, Carolinas Chapter and Philadelphia Chapter are excited to host their first ever tri-chapter event, Mid-Atlantic Advanced Learning Session - Failure is Never an Option, A Deep Dive into Failure Analysis.

Surface Mount Technology Association (SMTA)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Viscom Introduces New AOI Features with SI Software Release 7.45

Industry News | 2012-04-26 14:34:00.0

With its software, Viscom offers many useful additional features to make using AOI/AXI inspection systems in electronics manufacturing faster and more convenient.

Martel Marketing Communications, Inc.

Seika Machinery, Inc. Features the HIROX MX-BGAZ II Lens

Industry News | 2009-06-29 07:18:50.0

TORRANCE, CA — June 2009 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it now carries HIROX’s MX-BGAZ II Lens for easy and accurate BGA exterior observation.

Seika Machinery, Inc.

Why use Via in Pad Design?

Industry News | 2019-11-05 22:08:21.0

Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.

Headpcb

New release of a space-saving compact substrate inspection machine (AOI/SPI) “RV-2”

Industry News | 2015-10-06 19:39:34.0

JUKI released a space-saving compact PWB Inspection Machine "RV-2" at home and abroad in March 18. As a single-lane inspection machine, "RV-2" inherits the high-accuracy inspection capability of the high-end PWB Inspection Machine RV-1. This is an in-line type high-precision PWB inspection machine in space saving compact design.

Juki Automation Systems

Saki Demonstrates Advanced 3D AOI Capabilities at NEPCON China in Booth 1J25

Industry News | 2017-04-13 17:29:30.0

Saki Corporation will demonstrate the advanced capabilities and new extra component detection (ECD) feature of its BF-3Di 3D automated optical inspection (AOI) systems at NEPCON China on April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center in Shanghai, China, in booth 1J25.

SAKI America

Solder Preform World – Not New Technology but Very Interesting Option - Bob Willis Charity Webinar

Industry News | 2020-06-02 09:14:56.0

Our webinar is FREE to join but we do ask attendees to consider contributing a small amount to our chosen charities Mind – Better Mental Health https://www.mind.org.uk/donate Marie Curie – Living with Terminal Illness https://www.justgiving.com/mariecurie

ASKbobwillis.com

Saki Demonstrates 2D and 3D AOI and 3D SPI Systems at Productronica India in the PCI, iNETest, and Prosem booths

Industry News | 2019-09-26 12:16:40.0

Saki Corporation will present its 2D and 3D automated optical inspection (AOI) and 3D solder paste inspection (SPI) systems at Productronica India 2019. Productronica India is being held September 25-27 at the India Expo Center, Noida, Delhi, India. Saki technical experts will be available at the following booths: PCI booth PA11, iNETest booth PC11, and Prosem booth PE45.

SAKI America

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