Industry News | 2021-04-01 09:23:35.0
Low cost SMT assembly line solution is including 7 machines. It can mount chips: 0201, 0402, 0603, 0805, 1206, diode, transistor, SOT, and QFP/BGA which the size within 40*40mm and lead pitch ≥0.3mm etc. Any inquiry would be appreciated by Mobile/WeChat: 0086 13063047785 or scan my WeChat QR code. Yours sincerely Wellman Rau Senior Manager International Business Dept. Mobile/Wechat/WhatsApp: +86 130 6304 7785 Skype: wellmanrau@yeah.net Email: wellmanrau@yeah.net
Industry News | 2004-10-15 10:33:00.0
The new FLX2010 SMD pick+place from ESSEMTEC offers the most flexible
Industry News | 2013-09-16 14:38:01.0
VJ Electronix, Inc. and BEST, Inc. announce that Don Naugler and Bob Wetterman will be presenting a paper during technical session SMT3 BGA Profiling and Reballing at the upcoming SMTA International in Fort Worth, TX.
Industry News | 2009-04-09 22:35:29.0
The current economic climate, though challenging, certainly hasn't deterred the technology specialists at Henkel from continuing on an aggressive R&D path. As evidenced by an impressive five award wins during last week's APEX show in Las Vegas, Nevada, Henkel's commitment to innovation and materials advance is stronger than ever.
Industry News | 2009-06-02 14:13:36.0
With the majority of the electronics industry fully on board with lead-free manufacturing, solder paste materials requirements are now moving beyond basic functionality and toward more advanced, truly enabling capabilities.
Industry News | 2010-04-23 21:21:38.0
Never content to rest on the laurels of its proven lead-free success, Henkel has developed and launched Multicore LF620: a new lead-free solder paste that effectively delivers on a broad range of demanding requirements, essentially offering a lead-free paste that has it all.
Industry News | 2018-03-16 08:13:49.0
As a leading solder materials innovator, Henkel recognizes the need for more holistic solder paste process analysis, especially as device miniaturization and finer particle size solders become mainstream. While many suppliers and manufacturers use proprietary solder material evaluation tools, there is a requirement for easily-implemented, standardized test vehicles that address the realities of today’s manufacturing complexities, particularly in the process areas of printing and reflow. The electronics business of Henkel Adhesive Technologies has developed such a tool.
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