Industry News | 2023-07-10 18:25:44.0
ZESTRON is excited to announce an upcoming webinar titled, "Enhancing Yield and Reliability of Ultra-Fine Pitch Die through Defluxing on CoWs" on July 20th, 2023, at 2:00 PM EST.
Industry News | 2016-04-05 11:30:08.0
This mornings webinar was conducted on fine pitch rework and repair and include a survey of 72 company's. The recording is available on line at and a copy of the slides and survey results can be obtained direct from Bob Willis bob@bobwillis.co.uk
Industry News | 2011-10-12 21:39:45.0
Multitest announces that the Santa Clara board fab has refined its pulse plating process to integrate it into Multitest’s fabrication process to further enhance the high aspect ratio capability.
Industry News | 2013-10-02 22:57:57.0
Transition Automation announces a further refinement of the PrinTEK line of benchtop SMT printers. The enhancement gives users greater control of the Z-height adjustment that is critical for achieving high quality fine pitch printing.
Industry News | 2011-02-03 14:43:42.0
Multitest announces that Valts Treibergs, R&D Engineering Manager, and Chris Cuda, US Product Manager, will present "PCB Pad Wear Analysis at 0.4 mm Pitch ― the Story Continues…" at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, AZ.
Industry News | 2022-12-26 11:34:19.0
ZESTRON is pleased to announce that ZESTRON's Senior Application Engineer, Ravi Parthasarathy will be presenting, "Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs", at IPC APEX 2023 taking place in San Diego, California.
Industry News | 2017-02-09 08:35:06.0
FARNBOROUGH, UK ― February 2017 ― Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that its Chief Technology Officer Dr Chris Hunt will present the paper titled “SIR intercomparison to validate the use of fine pitch pattern” at the upcoming IPC APEX EXPO. The presentation will be held during the session titled “SIR/Flux Reliability” on Tuesday the 14th February between 15:30 – 17:00pm in location 4.
Industry News | 2010-07-29 14:45:16.0
Henkel’s non-conductive paste (NCP) solutions have long enjoyed a leading market position for traditional Gold – Gold flip chip processes. Recent NCP innovations from the global materials leader are also now enabling next-generation, high I/O fine-pitch technologies including new copper pillar (Cu Pillar) interconnects.
