Industry News | 2010-07-29 14:45:16.0
Henkel’s non-conductive paste (NCP) solutions have long enjoyed a leading market position for traditional Gold – Gold flip chip processes. Recent NCP innovations from the global materials leader are also now enabling next-generation, high I/O fine-pitch technologies including new copper pillar (Cu Pillar) interconnects.
Industry News | 2001-02-16 10:32:40.0
Juki Automation Systems has introduced the KE-2020, a high-speed flexible assembler designed to place small and odd shaped components, as well as standard components, at optimum speed. The KE-2020 is equipped with a high-speed four-nozzle head for placing components and has one fine-pitch placement head with one nozzle capable of placing 0201 components, micro BGAs, CSPs and other odd-shaped components.
Industry News | 2008-10-07 12:56:56.0
APS Novastar introduces automatic Vision Control for its L-Series pick and place systems. Vision Control advances the already precise, fast and reliable placement of 0201's with 100% accurate on-the-fly, bottom-up vision placement of micro BGA's and ultra fine pitch QFP's.
Industry News | 2011-03-11 14:47:03.0
Ironwood Electronics has recently introduced a new high performance BGA socket for 0.4mm pitch 221 ball BGA - SG-BGA7162. The socket operates at bandwidths up to 10 GHz with less than 1dB of insertion loss.
Industry News | 2011-04-06 14:07:24.0
Ironwood Electronics has recently introduced a new high performance BGA socket for 1.118mm pitch, 729 pin BGA IC's. The SG-BGA-6345 socket is designed for 31X31 mm package size and operates at bandwidths up to 8 GHz with less than 1dB of insertion loss.
Industry News | 2021-07-26 17:33:25.0
High thermal mass and fine-pitch components place increased demand on the selective soldering process. This tech paper outlines techniques that minizine these demands.
Industry News | 2003-06-20 18:28:55.0
Makes continuity and placement evaluation a snap.
Industry News | 2012-08-20 13:00:35.0
Multitest, announces that its Pulse Plating Process provides significant advantages in terms of fabrication cost and cycle time.
Industry News | 2012-08-20 13:01:17.0
Multitest, announces that its Pulse Plating Process provides significant advantages in terms of fabrication cost and cycle time.
Industry News | 2016-10-09 21:32:22.0
Topic: Study on a Formulated No Clean Flux for Fine-Pitch Flip Chip Package of Copper Pillar/ Micro-bump Interconnect. Time: October 18, 10:00 am – 1:30 pm Authors: Hsiang-Chuan Chen, Ya-Ching Chuang, Chia-Hao Chang, Watson Tseng
winsouce.jpg)