Industry News | 2023-04-03 13:35:15.0
ZESTRON is pleased to announce that Senior Application Engineer, Ravi Parthasarathy, will be presenting his paper "Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs" at the SMTA High Reliability: Strategic Technology Advancement Research Forum on April 18, 2023, in Kansas City, MO, USA.
Industry News | 2023-04-03 13:45:13.0
ZESTRON is pleased to announce that Senior Application Engineer, Ravi Parthasarathy, will be presenting his paper "Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs" at the SMTA High Reliability: Strategic Technology Advancement Research Forum on April 18, 2023, in Kansas City, MO, USA.
Industry News | 2012-01-17 11:05:35.0
Practical Components introduces a test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.
Industry News | 2013-02-04 14:14:48.0
Practical Components and its sister company Practical Tools will exhibit in booth A16 at the upcoming IPC APEX Expo
Industry News | 2020-12-21 09:16:23.0
MA Series PCB Terminal Blocks have between 2 and 24 positions with a 3.50mm, 5.00mm, 7.50mm or 10.0mm pitch
Industry News | 2012-09-04 08:51:32.0
Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.
Industry News | 2001-02-06 14:29:53.0
Juki Automation Systems has introduced the KE-2020, a high-speed flexible assembler designed to place small and odd shaped components, as well as standard components, at optimum speed.
Industry News | 2008-06-19 11:14:35.0
LOS ALAMITOS, CA � June 18, 2008 � Practical Components Inc., the leading supplier of dummy components, announces that in cases where only its mechanical characteristics are required, Practical Dummy Components can be used instead of live, functioning components. Because there is no expensive die inside the package, the cost for performing mechanical testing is significantly lower.
Industry News | 2009-01-21 20:01:04.0
Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present two papers, A Novel Flexible Ag (Silver) Paste and Next Level Requirements for Ultra Fine Pitch Printing, at the Pan Pacific Microelectronics Symposium held on the Big Island of Hawaii, February 10-12, 2009.
