Industry News: pitch (Page 14 of 95)

SMART Group Continues smart-e-webinar Series with Solder Sphere Webinar

Industry News | 2013-07-05 17:24:15.0

SMART Group announces that it will present the webinar “Using Solder Spheres in Fine-Pitch Area-Array Rework Plus Manufacturing Quality Control” on Tuesday 20th August 2013 at 14:30.

The SMART Group

SHENMAO PF735-P267J Low Melting Point Paste Is Designed for Jet Dispensing

Industry News | 2022-05-18 13:07:51.0

SHENMAO America, Inc. offers PF735-P267J Low Melting Point Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.

Shenmao Technology Inc.

SHENMAO Introduces PF606-P269J Lead-Free Paste Specially Designed for Jet Dispensing

Industry News | 2022-08-14 14:26:09.0

SHENMAO America, Inc. offers PF606-P269J Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.

Shenmao Technology Inc.

ZESTRON to Present at Upcoming iMAPS Device Packaging Conference

Industry News | 2024-03-04 11:49:43.0

ZESTRON proudly announces Senior Application Engineer Ravi Parthasarathy will be presenting defluxing strategies for high-density advanced packaging with ultra-fine pitch die on Chip-on-Wafer (CoW) technology during his presentation at the upcoming iMAPS Device Packaging Conference (DPC) on Thursday, March 21, from 10:30 AM to 11:30 AM.

3M Electrical Solutions Division

What's happening at CyberOptics Corporation in 2008?

Industry News | 2008-03-25 22:37:25.0

Comment from Steve DiMarco, Vice President of Sales & Marketing

CyberOptics Corporation

What's happening at FINETECH in 2008?

Industry News | 2008-03-25 23:22:33.0

Comment from Neil O�Brien, Director � US Sales

Finetech

Prototype and Debug 96 ball BGA with Ease

Industry News | 2011-02-14 16:05:28.0

Design engineers using 0.8mm pitch 96 position BGA ICs will be interested in the PA-BGA96C-Z-01 probing and prototyping adapter with GHz BGA socket from Ironwood Electronics. Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing clock driver IC's. The socket is constructed with high performance and low inductance elastomer contactor.

Ironwood Electronics

ECT’s CPG TO SHOWCASE THE ZIP® FAMILY AT THE INTERNATIONAL TEST CONFERENCE

Industry News | 2011-08-24 13:24:13.0

Everett Charles Technologies (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of “flat” technology Pogo® pins in booth 114 at the upcoming International Test Conference (ITC)

Everett Charles Technologies

Vitronics Soltec Products Win Two SMT China Vision Awards in Reflow and Selective Soldering Categories

Industry News | 2017-05-01 14:53:34.0

ITW EAE’s Vitronics Soltec earned two coveted VA Excellent Awards from the SMT China Vision Awards at the recent NEPCON China exposition and conference in Shanghai. The CATHOX™ Catalytic Thermal Oxidizer was recognized in the Reflow Soldering category and the ZEVAm took the prize in the Selective Soldering category.

Vitronics Soltec

Indium Corporation Expands Fine Wire Capabilities

Industry News | 2022-01-29 13:28:14.0

Indium Corporation has expanded its manufacturing capabilities to include a fine diameter 0.004" (0.10mm) flux-cored wire made with select Pb-free alloys to help customers meet the progressively demanding requirements of fine-pitch applications.

Indium Corporation


pitch searches for Companies, Equipment, Machines, Suppliers & Information