Industry News | 2001-06-15 15:37:28.0
FlexHybrid technology enables high-mix, high-throughput production
Industry News | 2003-07-08 09:09:15.0
Available for Devices Up to 13 mm2 with Speeds Up to 1 GHz
Industry News | 2008-12-15 14:16:12.0
Garden Grove, CA � December 2008 � Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, introduces its new TS7000 Interchangeable Material Path (IMP) Series Rotary valve.
Industry News | 2009-01-19 00:55:12.0
Garden Grove, CA � January 2009 � Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, announces that it will premier the TS7000 Interchangeable Material Path (IMP) Series Rotary valve in booth 1288 at the upcoming MD&M 2009 West exhibition & conference, scheduled to take place February 10-12, 2009 in Anaheim, Calif.
Industry News | 2009-03-02 00:28:54.0
DEK has announced the launch of its VectorGuard� Platinum stencil technology. Now available for DEK customers in Asia, Europe and the Americas, the new technology provides semiconductor manufacturers with an ideal solution for a diverse range of next-generation challenges.
Industry News | 2010-05-11 15:23:38.0
To help electronics manufacturers be more productive and successful, the high complexity of the various steps in the SMT process chain requires that all participants develop innovative solutions jointly and as early as possible so that workflows can be simplified and improved.
Industry News | 2011-06-13 17:22:02.0
Everett Charles Technologies’ (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of flat technology Pogo® pins in Booth #5670 in the North Hall at the upcoming SEMICON West, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco. A new eight-page ZIP® Product Portfolio brochure also will be available at the ECT CPG booth.
Industry News | 2011-11-08 14:17:32.0
Practical Components introduces a dummy (mechanical sample) version of Amkor’s cutting-edge CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT).
Industry News | 2013-03-28 11:03:15.0
Multitest, will present at the VOICE conference, scheduled to take place April 23-25, 2013 at the DoubleTree by Hilton Hotel in San Jose, CA. Meet Multitest’s experts to learn more about the company’s solutions, from wafer-level test to final test – for standard ICs and sensor packages.
Industry News | 2013-04-11 18:53:28.0
Multitest, will present at the Teradyne Users Group Conference, scheduled to take place April 29-May 1, 2013 in Fort Worth, TX. Meet Multitest’s experts to learn more about the company’s solutions, from wafer-level test to final test – for standard ICs and sensor packages.
