Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
Industry News | 2012-06-26 14:04:28.0
Techcon Systems today announced the addition of 32-pitch TS7000 model to the TS7000 Valve Series.
Industry News | 2010-11-30 13:30:04.0
Ironwood Electronics' new package converter - PC-BGA256B/BGA256E-B-01 allow previous product version to be used in the new system boards for test/validation until the new BGA device is released from the foundry or vice versa. These package converters can be soldered directly onto the SMT pads of development boards using standard solder methods.
Industry News | 2009-12-14 20:45:09.0
December 2009 ? Christopher Associates, a pioneering supplier and distributor to the electronics and chemical processing industries, introduces two new solder pastes from Koki Company Ltd. (Tokyo, Japan).
Industry News | 2016-03-07 20:10:00.0
ViTrox Technologies today announced that it will exhibit in Booth #5667 at SEMICON China 2016, scheduled to take place March 15-17, 2016 at Shanghai New International Expo Centre. The highlights of the show will be the TR2000i, VR20 and Vs 3DBGA!
Industry News | 2016-12-26 13:40:59.0
SMT Step Stencils provide increased control over your print process. Vary thickness in any area of your stencil to generate the exact paste volume and height for every single component. A perfect solution for Pin-in-Paste applications. For FREE Technical Assistance please call (760) 798-6984
Industry News | 2010-09-29 02:16:12.0
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its Fine-Pitch SMT Kit is now available in both lead-free and tin-lead versions. The lead-free component option is available with the ENIG board finish.
Industry News | 2011-02-26 14:35:16.0
Ironwood Electronics has recently introduced a new high performance WLCSP socket for 0.5mm pitch 40 ball WLCSP and 0.4mm pitch 30 ball WLCSP accommodated in the same socket.
Industry News | 2012-02-17 10:02:53.0
Samtec recently introduced a new 1mm pitch discrete wire system ideal for rugged applications where a highly reliable connection must be maintained. The cable assembly and connector feature a space-saving design and a choice of options to ensure a proper fit.
