Industry News | 2018-10-18 19:57:48.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at Chicago Marriott, Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.
Industry News | 2009-12-08 14:46:58.0
Whether coating, bonding, casting, printing or foaming is concerned – optimum and permanent adhesion can only be achieved with many substrates if the surface is pre-treated. The cold-active plasma beam of the patented Plasmabrush technology developed by Reinhausen Plasma opens up a whole range of new application possibilities for industrial processes under ambient pressure. Even temperature-sensitive substrates and thin-walled, fine and complex contours can be treated efficiently in a process that is both reliable and environmentally sound.
Industry News | 2013-11-02 14:18:48.0
Manufacturers of circuit boards, electronic components, SMD assemblies and subassemblies in search of sophisticated pretreatment solutions for their components will make a find on the Plasmatreat booth at the “Productronica 2013, the top trade show of innovative electronics in Munic,Germany.
Industry News | 2020-03-22 11:52:51.0
Flux manufacturers have already reported a remarkable shortage of stocks for alcohol-based fluxes used in electronics manufacturing. Interrupted supply chains and an increasing demand for alcohol as a basis for disinfectants has resulted in massive price increases.
Industry News | 2012-11-11 14:07:47.0
Plasmatreat North America (PTNA) offices have moved to new premises, which are located in Ancaster, Ontario (CAN), about 45 miles west of Toronto/ Pearson International Airport and about 90 miles from Buffalo/Niagara Airport (USA).
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
| 1 |
