Industry News | 2003-05-08 07:22:00.0
Over 400 contract manufacturers present every aspect of outsource capability.
Industry News | 2003-02-20 08:04:10.0
The Mini-Fix card-to-cable connector is designed to withstand hundreds of mating cycles with high contact security and mechanical stability.
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Industry News | 2003-04-08 10:28:06.0
A new range of high-performance press-fit D-subminiature terminations from GTK can be fitted easily to PCBs without the need for solder.
Industry News | 2003-05-30 08:09:11.0
A new compact package integrates a Hall-effect sensor IC with a back-biasing magnet to achieve high airgap performance and meet restrictive space requirement.
Industry News | 2003-03-25 08:31:07.0
On completion of the transaction, Flairis will become a wholly-owned subsidiary of Beyonics and its shares will be delisted from Sesdaq.
Industry News | 2014-09-06 17:51:35.0
IPC — Association Connecting Electronics Industries® has released the F revisions of two of the industry’s most widely used standards, IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies.
Industry News | 2018-06-14 12:10:52.0
Now available from FKN Systek, Stackable PCB Transport and Storage Racks made of conductive material for safe and convenient handling of Printed Circuit Cards during assembly. These Racks will hold up to 50 PCBs from 2” to 9.8” (5 to 25 cm) wide. Racks are made of conductive plastic temperature rated to 176 O F, Surface resistance
Industry News | 2018-10-18 08:53:06.0
Mixed process of SMT reflow oven
Industry News | 2008-09-02 15:34:36.0
Minneapolis, MN � The 2008 Charles Hutchins Educational Grant recipient, Lei Nie, a graduate student in the field of Mechanical Engineering at the University of Maryland, has been selected by the SMTA Grant Committee for her project entitled "Reliability of Reballed and Reworked Plastic Ball Grid Arrays in SnPb and SAC Assembly Process".
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