Industry News: plating flex circuits with enig cracking (Page 1 of 1)

Updates to IPC-6012 and IPC-A-600 Released: Five Years of New Board Technologies and Processes Bring Significant Changes to Specifications.

Industry News | 2010-04-10 02:09:54.0

If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.

Association Connecting Electronics Industries (IPC)

Volunteers Honored for Contributions to IPC and the Electronics Industry at IPC APEX EXPO 2020

Industry News | 2020-02-18 15:10:01.0

IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on February 3 and 5 at IPC APEX EXPO 2020 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.

Association Connecting Electronics Industries (IPC)

Catching up with PNC

Industry News | 2015-11-16 10:47:48.0

Catching up with PNC with Dan Beaulieu, D.B. Management Group

PNC Inc.

chinese famous pcb(printed circuit board) manufacturer with top quality and lower price

Industry News | 2012-07-10 21:45:26.0

Head Electronic Co., Ltd. is an experienced professional manufacturer of printed circuit boards in mainland China since 2000. We are specialized in PCB manufacturing, PCB prototype and PCB Fabrication.

Headpcb

PNC announces the latest add-on qualification to Military Performance Specification MIL-PRF-31032

Industry News | 2015-03-16 11:44:31.0

PNC is proud to announce the latest add-on qualification of product testing to Military Performance Specification MIL-PRF-31032, CAGE Code 66766.

PNC Inc.

Guideline for wire bonding

Industry News | 2019-11-05 22:19:03.0

> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.

Headpcb

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plating flex circuits with enig cracking searches for Companies, Equipment, Machines, Suppliers & Information

Hitech Circuits Co., Limited
Hitech Circuits Co., Limited

Hitechpcba is a wоrld-lеаding PCB Manufacturing & PCB Assembly company with more than 20 years experience in the electronics manufacturing industry. We focus on Circuit board fabrication, PCB assembly, electronic parts sourcing.

Manufacturer

3F, B5 Dong, Zhimeihuizhi, FuYong, Bao'an Dist.
Shenzhen, China

Phone: 008675529630063