Industry News | 2003-04-22 09:33:13.0
Honda Connectors has released its first Infiniband I/O connectors, designed for easy assembly in high-speed differential signal applications.
Industry News | 2023-07-22 11:28:46.0
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Industry News | 2012-12-03 11:35:40.0
Count On Tools Inc. (COT) introduces additional accessories for its revolutionary StripFeeder System for loading tape-and-reel components onto compact modules for prototype and high-mix/low-volume applications.
Industry News | 2013-07-17 14:48:05.0
Count On Tools (COT) Inc. announces a new addition to its custom nozzle engineering services with the Full Solution Package for Odd-Form Components.
Industry News | 2013-02-20 19:23:22.0
Count On Tools Inc. (COT) announces that it has been awarded a 2013 NPI Award in the category of Automation Tools for its StripFeeder Modular System
Industry News | 2003-04-22 08:10:17.0
EAO introduces the 1K2, a superior quality changeover slide switch recommended for PCB configuration applications. The products is recommended for PCB configuration applications and occupies a board space measuring only 10mm x 2.5mm with a height of 4.5mm excluding actuator.
Industry News | 2006-06-23 16:19:47.0
Group Addresses Assembly Process and Reliability Requirements for SnPb and Pb-free Modules
Industry News | 2012-04-09 13:45:59.0
As the electronics assembly industry evolves, printed circuit board (PCB) features and surface mount technology (SMT) components continue to get smaller and smaller. This miniaturization shrinks the process window at print, placement, and reflow, increasing the opportunities for defects.
Industry News | 2018-10-18 10:18:58.0
Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
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