Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2010-09-22 15:01:40.0
Removing heat has become a major issue in the electronics industry as more highly integrated devices are jammed into less space and as high power devices, such as LEDs, become increasingly more common.
Industry News | 2010-04-23 22:01:16.0
BANNOCKBURN, Ill. IPC - Association Connecting Electronics Industries® has released IPC-4202A, Flexible Base Dielectrics for Use in Flexible Printed Circuitry. This document provides comprehensive data to help users more easily determine the capability and compatibility of flexible base dielectric materials in manufacturing flexible printed circuitry and flexible flat cables.
Industry News | 2012-06-01 13:55:57.0
As chip speeds skyrocket and system sizes diminish, designers and manufacturers face new and complex challenges
Industry News | 2009-04-15 16:24:57.0
WESTMORELAND, N.H. � April 2009 �Polyonics introduces four new materials to help win over new and existing projects.
Industry News | 2010-04-12 16:09:04.0
RESEARCH TRIANGLE PARK, N.C. — DuPont Circuit & Packaging Materials (CPM) introduced its newest high-performance laminate for printed circuit boards. DuPont™ Pyralux® TK flexible circuit material is a copper clad laminate and bonding film system specifically formulated with DuPont™ Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. DuPont™ Pyralux® TK delivers the lowest dielectric constant (DK) of any thin laminate and bondply material on the market today.
Industry News | 2009-11-01 00:31:08.0
BEAVERTON, OR — October 2009 — A-Laser, a division of FCT Assembly and a premier laser cutting service specializing in the ablation of ultra-thin metals and plastics, provides the cleanest cut for DuPont Kapton films.
Industry News | 2010-11-24 16:26:50.0
Selecting a durable substrate for your printed electronics application can be half the required effort. Protecting the printed circuit from harsh environments by encapsulating with a protective overlay may be required. To help provide this protection, Polyonics is offering protective overlays designed to withstand harsh environments.
Industry News | 2010-06-28 19:23:30.0
PFC Flexible Circuits Qualifies New, High Speed DuPont™ Pyralux® TK Flexible Circuit Material
