Industry News | 2012-06-18 14:49:38.0
Reliability and Failure Analysis Seminar: Lessons Learned in Manufacturing. Presented by Universal Instruments Corporation’s Advanced Process Laboratory. Hosted by Textron Defense Systems, 201 Lowell St., Wilmington, MA
Industry News | 2022-05-05 17:28:46.0
Includes new, easy-to-operate pail pump with unique pail change and loading method, which also reduces material waste
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Industry News | 2021-04-01 08:22:32.0
A new kind of software finally puts an end to messages like "Instruction not received", "Documentation not available", or "Troubleshooting tip not received". ASM FactoryChat is the first professional messenger software for secure communication and the reliable transfer of knowledge in electronics production. ASM Factory keeps messages from employees and management, shift reports, machine documentations, work instructions, videos and more at the ready by locations, lines, machines, and software. Even messages and alarms from machines and software can be added to the shop floor communication with ASM FactoryChat and displayed in a browser. Also new is the licensing model: Customers can rent the software as needed and easily scale it up or down. And thanks to its open approach, ASM FactoryChat can be used with machines and systems from other suppliers in all areas, even outside of the SMT lines. For interested parties, ASM offers a free 60-day test license that is fully functional.
Industry News | 2012-04-06 19:44:17.0
In SMT electronic assembly production, 3-D SPI has established itself as the additional inspection gate to complement optical or X-ray inspection.
Industry News | 2003-03-11 09:04:04.0
Developed in response to customer requirements, the new Via Fill process from DEK delivers 100% fill of substrate vias with no voids and minimal surface residue.
Industry News | 2017-05-21 10:12:34.0
Cleaning printed circuit boards has become more popular again due to the complexity of many board assemblies and coupled with the use of conformal coating. Products are often exposed to environments that often result in failures if bare boards or assemblies are no cleaned see http://www.bobwillis.co.uk
Industry News | 2020-05-30 12:36:38.0
SEHO Systems GmbH has registered the patent for a new mini-wave solder nozzle that remarkably improves the selective soldering process in many ways. The patent-pending LongLife solder nozzle is compatible with both SEHO selective soldering systems and different brands.
Industry News | 2017-01-18 05:21:35.0
This photo CD ROM provides the process or quality engineer with a source of PIHR photographs of the assembly process, components and process defects which may be used in company inspection document or training presentations. They may be simply pasted into any document for in house company use. Now over 250 photographs are provided in either jpg or tif file format for use in PowerPoint, Word inspection standards or online publications royalty free http://www.bobwillis.co.uk/product-category/photo-cd-rom/
Industry News | 2015-05-13 14:00:03.0
The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.
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