Industry News | 2016-02-11 13:36:43.0
Indium Corporation's Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability.
Industry News | 2021-10-18 15:09:32.0
Insituware LLC is pleased to announce that Morgan Miller, Application Engineer, will present during the SMTA International Conference, scheduled to take place Nov. 1-4, 2021 at the Minneapolis Convention Center. Ms. Miller will present: "Correlation of Solder Paste Electrochemical Impedance Spectroscopy (EIS) Measurements to Solder Paste Inspection (SPI) Performance."
Industry News | 2022-03-25 08:07:42.0
Easily monitor process fluids in real time with LiquiSonic®
Industry News | 2009-07-02 17:51:04.0
Recognising that too many print processes are compromised by poor quality Consumables, DEK’s Process Improvement Products are designed to boost productivity and yield, reduce the risk of defects and minimise rework.
Industry News | 2009-07-07 13:32:54.0
Recognising that too many print processes are compromised by poor quality Consumables, DEK’s Process Improvement Products are designed to boost productivity and yield, reduce the risk of defects and minimise rework.
Industry News | 2017-01-05 04:27:37.0
BGA Inspection & Defect Photo Album (Can be downloaded) The photo CD-ROM album featuring over 280 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The disk includes examples of the following:
Industry News | 2018-03-12 14:11:35.0
Kester is proud to announce the launch of NP560, a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance.
Industry News | 2022-06-16 17:51:32.0
ASC International is pleased to announce that the LineMaster Fusion 3D takes inline SPI to a new level with its unmatched price to performance value proposition. The Fusion 3D provides all of the required features for high-speed inline 3D solder paste inspection at an amazingly affordable price.
Industry News | 2009-07-28 12:23:26.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
Industry News | 2009-07-30 21:06:08.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
