Industry News: poor paste transfer (Page 8 of 32)

Indium Corporation Announces RMA-155 Pb-Free Solder Paste.

Industry News | 2014-07-09 10:22:05.0

Indium Corporation recently released RMA-155 Pb-Free Solder Paste. RMA-155 is the best solder paste for customers who are required to use RMA materials, but who need the performance benefits of modern Pb-free solder paste technology.

Indium Corporation

Nihon Superior to Highlight TempSave Soldering Materials and SN100CV P608 Paste at SMTAI

Industry News | 2022-10-06 18:19:54.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #1230 at the SMTA International Exposition, scheduled to take place Nov. 2-3, 2022 at the Minneapolis Convention Center in Minneapolis, MN. The company also will showcase SN100CV P608 solder paste.

Nihon Superior Co., Ltd.

Nihon Superior to Highlight TempSave Soldering Materials at IPC APEX

Industry News | 2022-12-21 10:42:04.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #1433 at the IPC APEX Exposition, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in San Diego, CA. The company also will showcase LF-C2 P608 solder paste.

Nihon Superior Co., Ltd.

Nihon Superior to Highlight SN100CV P608 Paste at SMTAI

Industry News | 2023-09-11 17:19:08.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its SN100CV P608 solder paste in Booth #1415 at the SMTA International Exposition, scheduled to take place Oct. 10-11, 2023 at the Minneapolis Convention Center in Minneapolis, MN.

Nihon Superior Co., Ltd.

FCT to Showcase Advanced Printing Technologies at APEX 2016

Industry News | 2016-02-25 12:54:53.0

FCT Assembly (www.fctassembly.com), well-known in the electronics assembly industry for its Fine Line Stencil and FCT Solder divisions, will highlight its broad portfolio of printing products at IPC APEX 2016 (www.ipcapexexpo.org), as well as take part in multiple technical conference programs. From booth # 1139 over March 15 - 17, the FCT exhibit will play host to the company’s various technologies including innovative step/relief stencil capabilities, NanoSlic Gold coated stencil and newly formulated, pre-released water soluble paste, WS890.

FCT ASSEMBLY, INC.

How the modern solder reflow oven works?

Industry News | 2018-10-18 08:36:26.0

How the modern solder reflow oven works?

Flason Electronic Co.,limited

Indium Corporation Technology Experts to Present at IPC Southeast Asia High Reliability Conference

Industry News | 2014-08-07 11:41:44.0

Indium Corporation's Sze Pei Lim, technical manager - Southeast Asia; and Sehar Samiappan, area technical manager, will present at the IPC Southeast Asia High Reliability Conference on August 20 in Penang, Malaysia.

Indium Corporation

Nihon Superior to Bring the Latest Developments in Solder Technology to SMTAI

Industry News | 2014-08-26 16:19:51.0

Nihon Superior Co. Ltd. will exhibit in Booth #410 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.

Nihon Superior Co., Ltd.

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Industry News | 2018-10-18 08:21:10.0

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Flason Electronic Co.,limited

Nihon Superior to Highlight TempSave Soldering Materials and SN100CV P608 Paste at SMTAI

Industry News | 2021-10-07 15:29:25.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #3301 at the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. The company also will showcase SN100CV P608 solder paste.

Nihon Superior Co., Ltd.


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