Industry News: poor paste transfer (Page 10 of 28)

Package Cleaning at IMAPS METRO Symposium

Industry News | 2015-05-11 17:16:30.0

KYZEN is pleased to announce that Debbie Carboni will present at the IMAPS METRO Chapter Full Day Symposium and Vendor Night, scheduled to take place Wednesday, May 13, 2015 at the Clarion (former Holiday Inn) in Ronkonkoma, New York. Carboni will present the paper entitled, “Advanced Packaging Cleaning Fluid Best Practice.”

KYZEN Corporation

East/West Manufacturing Enterprises Appoints New Director of Quality

Industry News | 2019-06-09 19:42:17.0

East/West Manufacturing Enterprises, one of the industry’s leading full service EMS companies, today announced Mr. Hari Krishnamurthy as the Director of Quality.

East/West Manufacturing Enterprises

AIM to Highlight New NC259 Solder Paste at SMTA International 2012

Industry News | 2012-09-13 14:02:26.0

AIMannounces that it will highlight its new NC259 Solder Paste in booth #401 at the upcoming SMTA International Conference and Expo,

AIM Solder

SHENMAO Develops New Joint-Enhanced Flux

Industry News | 2020-11-09 14:21:48.0

SHENMAO America, Inc. is pleased to introduce its newly developed Joint-Enhanced FluxSMEF-Z3. The new no-clean flux has been designed for fine-pitch assembly and LED die attach.

Shenmao Technology Inc.

Indium Corporation Low-Voiding Solder Paste Helps Users Avoid the Void at Productronica 2015

Industry News | 2015-11-12 12:08:30.0

Indium Corporation presented its suite of void-reducing solder pastes, including halogen-free, no-clean Indium8.9HF, at Productronica 2015, Nov. 10-13, in Munich, Germany.

Indium Corporation

Indium Corporation's New Indium10.2HF Solder Paste Delivers Superior ICT Performance

Industry News | 2016-04-12 13:29:35.0

Indium Corporation announces the release of Indium10.2HF, a halogen- and Pb-free, no-clean solder paste that is specifically formulated to address in-circuit testing challenges. Indium10.2HF provides low cost-of-ownership to PCB assemblers through all-around balanced performance.

Indium Corporation

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces PF606-P116 / PF606-P128 / PF606-XP LED Die Bonding Solder Pastes

Industry News | 2016-06-05 13:20:49.0

SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations.

Shenmao Technology Inc.

Indium8.9HFA Solder Paste Sees Accelerated Adoption for Miniaturized Assemblies

Industry News | 2013-11-01 13:32:41.0

Indium Corporation's Indium8.9HFA Solder Paste is a versatile, halogen-free, Pb-free, solder paste with leading print performance on miniaturized components. Assemblers and OEMs are adopting this remarkable new product at an accelerating pace.

Indium Corporation

MET Stencil Launches NanoSlic® Gold coated Stencil

Industry News | 2016-02-10 17:03:46.0

MET Stencil announces the launch of the NanoSlic® Gold stencil. NanoSlic® is the world's most advanced stencil coating technology for improving solder paste printing. "We are pleased to announce that we have been licensed by FCT Assembly to sell this coating to the US market.” said Fred Cox, President of MET Stencil. "Stencil users will immediately see the benefits in their print."

MET Stencil

Indium Corporation to Present at SPIE Photonics West

Industry News | 2021-12-17 16:30:28.0

One of the most highly demanded applications for 80Au20Sn is semiconductor laser die-attach due to recent advancements that have made lasers an economical option for a multitude of new products. However, a key challenge with semiconductor lasers is thermal management, as these devices generate a significant amount of heat. Indium Corporation Product Specialist Jenny Gallery will present on how to manage heat with AuSn preforms at SPIE Photonics West, Jan. 22-27, San Francisco, Calif., U.S.

Indium Corporation


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