Industry News | 2009-12-17 18:14:47.0
MINNEAPOLIS, MN - The SMTA is pleased to announce the Best Papers from SMTA International 2009. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.
Industry News | 2012-11-22 03:16:22.0
This is the first text book covering every step in this exciting manufacturing and design lead technology.
Industry News | 2012-06-17 10:57:29.0
Brand new technology center for visitors to SMTA International,See it, hear it and do it at SMTAI "Spend a couple of hours with the POP Team and you will have a significant advantage when specifying or implementing this technology in your future products" for further information visit http://www.smta.org/smtai/pop.cfm Bob Willis POP Center Coordinator
Industry News | 2013-01-19 05:42:49.0
Through Mould Via (TMV) is referred to as a second generation package on package device developed by AMKOR and incorporated into many of the leading mobile devices. The process of assembly provides some challenges event to those using the traditional PoP devices.
Industry News | 2012-10-12 04:01:50.0
Package On Package Assembly Inspection & Quality Control Guide is the first text book covering every step in this exciting manufacturing and design lead technology and its going to be available FREE.
Industry News | 2017-04-13 06:06:32.0
Solderability Benchmarking, Failures & Testing Methods 14th August All our webinars are based on 2.30pm UK time go to https://www.bobwillis.co.uk/events/ Benchmarking you PCB surface finish or the impact of baking boards or components can be simple in production and the laboratoy. Long term solderability of component terminations and printed circuit boards is fundamental in modern assembly processes. This is all practical experience not just theory for the presenters countless studies in industry
Industry News | 2016-03-14 05:03:19.0
We have written two eBook’s Guide to Pin In Hole Intrusive Reflow Design and Assembly and Package On Package Design and Assembly, both are available to download free of charge
Industry News | 2010-09-03 03:48:15.0
Bob Willis will be presenting a hands on x-ray inspection workshop with FREE x-ray book and the chance to win x-ray inspection CDs and inspection posters.
Industry News | 2012-12-20 19:01:46.0
SMART Group,announces that it will present the webinar “100 Years of X-ray Advancement” on Tuesday, 29 January, 2013, at 2:30 p.m. (GMT).
Industry News | 2014-12-29 06:42:54.0
From 21 to 23 April 2015, the mega event in electronics manufacturing - the 25th edition of NEPCON China will be held at the Shanghai World Expo Exhibition & Convention Center. NEPCON China, one of the largest SMT exhibitions of Electronics Manufacturing Automation (EMA) equipment and techniques in Asia, is co-organized by the world’s largest exhibition organizer, Reed Exhibitions, and the CCPIT Electronics & Information Industry Sub-council. It is one of the most authoritative events in electronics manufacturing across China and Asia-Pacific. As an event organizer deeply trusted by industry professionals.
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