Industry News | 2012-06-17 10:57:29.0
Brand new technology center for visitors to SMTA International,See it, hear it and do it at SMTAI "Spend a couple of hours with the POP Team and you will have a significant advantage when specifying or implementing this technology in your future products" for further information visit http://www.smta.org/smtai/pop.cfm Bob Willis POP Center Coordinator
Industry News | 2012-09-10 09:15:27.0
MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year.
Industry News | 2010-08-17 08:13:44.0
Package on Package (PoP) component applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers.
Industry News | 2015-02-19 10:13:46.0
In the last couple of years Bob has produced two free EBooks for engineers, each with over 100 pages of information, tips and illustrations to make introduction easier. Both titles are based on practical experience using these techniques in manufacture in different sites.
Industry News | 2010-03-30 14:05:45.0
MORRISVILLE, NC - Juki Corporation is pleased to announce that Gerry Padnos, Director of Technology, will present a paper titled "PCB Assembly System Set-Up for Package-on-Package (PoP) Technology" at the upcoming IPC/APEX conference and exhibition.
Industry News | 2016-04-20 17:17:54.0
Tropical Assemblies, Inc. has enhanced its advanced manufacturing capabilities with the acquisition of (PoP) Package on Package technology equipment and processes. Furthering the support for the surging customer requirements of the company's electronic manufacturing services.
Industry News | 2011-01-05 17:46:58.0
Practical Components Inc. announced the availability of daisy chain samples of Amkor Technology, Inc.’s TMV® PoP (Package on Package) solution.
Industry News | 2012-02-15 19:16:37.0
SMART Group will host a Webinar titled “Package on Package (PoP) Assembly Process & Inspection” on Thursday March 15, 2012 from 2:30-3:30 p.m. GMT.
Industry News | 2012-09-10 10:44:36.0
Juki Automation Systems, will participate in the Package-on-Package (PoP) Design and Assembly Center during the annual SMTA International conference, scheduled to take place October 14-18, 2012 in Orlando, FL.
Industry News | 2009-07-28 12:23:26.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.