Industry News: popped (Page 7 of 32)

New Tacky Flux Technology from Henkel Advances POP Processes and has Cameras Seeing Blue

Industry News | 2009-07-28 12:23:26.0

In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.

ASM Assembly Systems (DEK)

New Tacky Flux Technology from Henkel Advances POP Processes and has Cameras Seeing Blue

Industry News | 2009-07-30 21:06:08.0

In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.

Henkel Electronic Materials

Reworkable Underfill for Package-on-Package (POP)

Industry News | 2009-09-17 17:02:12.0

EAST HANOVER, NJ – Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.

Zymet, Inc

Christopher Associates/Koki Solder to Present Investigation into the Development of Lead-Free Solder Paste for Package on Package (PoP) Applications at SMTAI 2010

Industry News | 2010-09-27 23:01:06.0

Christopher Associates/Koki Solder announces that Jasbir Bath will present a paper titled “An Investigation into the Development of Lead-Free Solder Paste for Package on Package (PoP) Component Manufacturing Applications” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Christopher Associates Inc.

See a Live Demonstration of the Nordson DAGE XD7600NT Diamond X-Ray Inspection System in the PoP Center at SMTA International

Industry News | 2012-09-10 11:55:25.0

Nordson DAGE announces that it will participate in the Package-on-Package (PoP) Design and Assembly Center during the annual SMTA International conference, scheduled to take place October 14-18, 2012 in Orlando, FL.

Nordson DAGE

New Underfill from Zymet for 0.4-mm pitch POP's

Industry News | 2012-01-13 13:20:53.0

Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.

Zymet, Inc

Bob Willis PoP and BGA Inspection Webinars sponsored by Nordson DAGE

Industry News | 2010-08-27 07:25:03.0

Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers.

ASKbobwillis.com

Akrometrix LLC to Present PoP Reflow Assembly Findings at IEMT

Industry News | 2014-10-14 19:36:17.0

Akrometrix LLC will present and exhibit at the 36th International Electronics Manufacturing Technology Conference (IEMT), scheduled to take place November 11-13, 2014 at the Renaissance Johor Bahru Hotel in Johor, Malaysia.

Akrometrix

Practical Components Offers Dummy Triple Stack Package on Package

Industry News | 2008-05-23 18:09:23.0

LOS ALAMITOS, CA � May 20, 2008 � Practical Components Inc., the leading supplier of dummy components, announces the availability of a dummy version of the Amkor� middle stacked package that makes a Triple Stack PoP package (PSvfBGA).

Practical Components, Inc.

Nordson DAGE’s Global X-ray Sales Director Keith Bryant to Present at the Package on Package (PoP) Design Center at SMTA International

Industry News | 2012-09-28 16:09:42.0

Nordson DAGE announces that Keith Bryant, Global X-ray Sales Director, will present at the PoP Design and Assembly Center during the annual SMTA International conference

Nordson DAGE


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