Industry News | 2010-05-20 15:11:27.0
The fifth EM Asia Innovation Awards recently honored DEK Solar for the technology breakthrough represented by its PV3000 photovoltaic metallization solution. Celebrating the highest standards in manufacturing technologies, the prestigious industry accolade recognizes the significant role played by DEK Solar in the field of solar cell production.
Industry News | 2011-04-07 11:31:09.0
Practical Components announces that its dummy components have been invited to be part of the "Future Proof Assembly Line" at the upcoming National Electronics Week exhibition, which is scheduled to take place April 12-13, 2011 at NEC Birmingham, United Kingdom.
Industry News | 2012-02-03 13:29:38.0
Practical Components will feature its new Amkor PoP stacked packages, including the new TMV PoP, along with its full line of dummy component packages in Booth #538 at the upcoming IPC APEX Expo.
Industry News | 2012-02-23 16:37:47.0
A rework station with higher-resolution split-vision for easier and more accurate alignment has been introduced by Manncorp. The lead-free system BR750, to be exhibited at Manncorp’s APEX booth #2907, also contains ultra-precise processing controls to meet the challenge of removal and placement of BGAs, CSPs, QFNs, PoPs and other subminiature surface mount devices.
Industry News | 2013-01-14 17:35:33.0
ACD, will exhibit in Booth #817 at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California.
Industry News | 2001-12-17 10:12:53.0
CEERIS Discounts End 12/31/01
Industry News | 2008-03-26 00:29:12.0
Comment from Don Naugler, President
Industry News | 2016-03-14 05:03:19.0
We have written two eBook’s Guide to Pin In Hole Intrusive Reflow Design and Assembly and Package On Package Design and Assembly, both are available to download free of charge
Industry News | 2008-10-16 18:50:08.0
San Diego � October 2008 � KIC, the leader of thermal process development and control products and winner of multiple industry awards, announces that MB (Marybeth) Allen will present a paper at the European and International Electronics Assembly Reliability Summit in Tallinn, Estonia from October 22-24, 2008. The event will be held at the Tallink Spa & Conference Hotel over two days and will be preceded by training workshops from top trainers in their field.
Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
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