Industry News | 2003-05-28 08:20:13.0
Aiming to promote its environmental activities on a global basis, the use of lead-free solder conforms to the European Union's regulation on restrictive use of toxic substances.
Industry News | 2003-03-14 09:03:48.0
Sarantel has developed a surface-mount version of its active GeoHelix miniature GPS antenna.
Industry News | 2003-02-06 08:28:24.0
Will Premiere Its 2002 Roadmap at IPC SMEMA Council�s APEX Conference in Anaheim, CA, March 31-April 2
Industry News | 2023-04-26 08:28:03.0
Computers and mobile phones are the most common electronic products in our daily life. They all adopt modern electronic technology and communication technology, providing great convenience and entertainment for people.
Industry News | 2010-06-04 16:23:16.0
BANNOCKBURN, Ill., USA — The IPC Solder Products Value Council (SPVC) has published a free white paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, that provides a set of test protocols for the evaluation of new lead-free alloys on the basis of their physical properties. Developed in cooperation with leading original equipment manufacturers (OEMs) and electronics manufacturing services (EMS) companies, the white paper will help the electronics assembly industry reduce the time and effort required to characterize an alloy and improve its processes without jeopardizing reliability.
Industry News | 2014-08-18 10:23:40.0
The IPC Solder Products Value Council (SPVC), in cooperation with iNEMI, has written a white paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, that helps users determine which alloy characteristics best match their requirements.
Industry News | 2012-08-09 18:42:34.0
IPC has released IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.
Industry News | 2013-04-25 16:41:53.0
IPC Electronic System Technologies Conference (IPC ESTC), Tuesday, May 21, 2013, in Las Vegas.
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Industry News | 2015-10-11 15:49:37.0
Each year, IPC APEX EXPO® features industry’s most dynamic and innovative minds to deliver keynote presentations that are forward thinking, inspirational and entertaining. IPC APEX EXPO 2016 will feature Dean Kamen, inventor, entrepreneur and tireless advocate for science and technology, as the opening keynote presenter on Tuesday, March 15, 2016. Kamen will present, “Inventions and Innovations.”
