Industry News | 2011-11-08 15:31:27.0
The SMTA and Chip Scale Review magazine are pleased to announce the 8th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success.
Industry News | 2013-06-20 19:24:42.0
IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2010-01-07 20:23:59.0
Universal Instruments has expanded the lead span capability of its class-leading Radial 8XT insertion machine by introducing the industry’s first 5.0/7.5/10.0mm triple-span radial machine. This large span capacity virtually eliminates tedious manual assembly requirements to improve product quality and provide greater returns for through-hole applications.
Industry News | 2021-03-02 14:45:26.0
SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.
Industry News | 2021-08-26 11:02:27.0
SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.
Industry News | 2025-02-08 21:40:47.0
Booth 1120
Industry News | 2010-03-17 18:31:55.0
EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to higher CTE underfills, provides superior thermal cycle performance.
Industry News | 2014-10-15 15:32:17.0
BTU International, Inc. announces that it will exhibit with its representative Gemmy-Tek Technology Co., Ltd., in Booth A0306 at PV Taiwan, scheduled to take place October 22-24, 2014, at TWTC Exhibition Hall 1.
Industry News | 2018-09-27 14:40:48.0
Professional and portable high performance PC-controlled RF source for benchtop or modular use
