Industry News | 2004-04-22 10:53:51.0
Parvus GPS Module Supports NMEA and Binary GPS Protocols in Vehicle Navigation, Tracking and Telematics Applications
Industry News | 2011-02-02 11:44:55.0
Data I/O Corporation announced support for Panasonic NPM Surface Mount Placement Machines with the ProLINE-RoadRunner™. Customers with a Panasonic NPM model SMT machine can now plug the ProLINE-RoadRunner directly into the SMT placement machine and program memory devices just before placement on the circuit board.
Industry News | 2010-08-17 14:46:57.0
Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of Version 1.4 of its ispLEVER® Classic design tool suite. The ispLEVER Classic design software has been upgraded with the addition of Synopsys Synplify Pro with the HDL Analyst feature set, and an improved ispMACH® 4000ZE CPLD fitter with improved power optimization.
Industry News | 2011-05-19 18:16:53.0
Data I/O Corporation will showcase its FlashPak III and ProLINE-RoadRunner™ at the upcoming SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 9, 2011 at the Sheraton Bloomington Hotel in Bloomington, MN.
Industry News | 2010-11-15 22:12:10.0
Data I/O Corporation and Matthew Associates will showcase the FlashPak III and ProLINE-RoadRunner™ systems at the upcoming SMTA Nutmeg Expo & Tech Forum
Industry News | 2011-02-24 21:33:45.0
JEDEC Solid State Technology Association today announced the publication of its next-generation storage system standard, Universal Flash Storage (UFS). UFS is designed to be the most advanced specification for both embedded and removable flash memory-based storage in mobile devices such as smart phones and tablet computers.
Industry News | 2011-04-22 21:43:04.0
Data I/O Corporation will showcase the FlashPak III and ProLINE-RoadRunner™ in Booth #772-773 at the upcoming Del Mar Electronics Show, scheduled to take place May 4-5, 2011 at the Del Mar Fairgrounds in Del Mar, CA.
Industry News | 2016-02-21 12:30:16.0
KIC today announced the release of a new white paper, entitled ‘Making Ovens Smarter,’ that sets out to explain the value of — and the path to — smarter reflow ovens. The paper, which is available for download in numerous places including leading industry media sites, discusses trends such as Industry 4.0, Smart Factory, IoM (Internet of Manufacturing) and IoT (Internet of Things) as well as offers an explanation of benefits that can be gained by making ovens smarter and connected.
Industry News | 2004-05-10 11:27:07.0
Parvus Audio Card Offers Powerful 2 Watts per Channel Output for Recording, Compressing and Playing Back CD Quality Sound
Industry News | 2007-10-23 02:23:25.0
Agilent Technologies Inc. (NYSE: A) today introduced the enhanced version of the Agilent VEE 8.5 graphical programming software for test and measurement, equipping users with more functions and support for the latest software tools and operating systems in the industry, including Windows Vista.
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