Industry News | 2008-02-28 21:48:17.0
OXFORD, CT � February 2008 � MIRTEC a leading global supplier of AOI systems to the electronics manufacturing industry, announces that it will introduce its MV series of AOI systems in booth 1857 at the upcoming APEX exhibition & conference scheduled to take place April 1-3, 2008 in Las Vegas.
Industry News | 2015-04-07 11:25:45.0
MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Industry News | 2009-03-16 18:07:28.0
OXFORD, CT � March 2009 � MIRTEC, �The Global Leader in Inspection Technology,� announces that it will introduce the latest advancements to its MV Series of AOI systems as well as unveil the company's first In-Line SPI System, the MIRTEC MS-11, in booth 147 at the upcoming APEX exhibition & conference scheduled to take place March 31- April 2, 2009 in Las Vegas.
Industry News | 2014-08-04 16:04:28.0
Mark Capizzi appointed as Equipment Marketing and Support Manager
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2011-08-24 17:13:21.0
The IPC Conference on Reliability: Assembly Process for a Reliable Product will be held November 1-2, 2011, in Irvine, Calif. The conference will address reliability issues that arise at the assembly level, dedicating half-day programs on new developments in each of three key areas: materials, processes, and test and inspection.
Industry News | 2014-09-18 17:55:32.0
SMTA China announcing that it presented awards for nine papers at the SMTA China South 2014 Conference Award Presentation Ceremony, held on Tuesday, August 26, 2014 at Shenzhen Convention & Exhibition Center in conjunction with the SMTA China Annual Award Ceremony.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2016-05-25 18:26:38.0
BEST's 2nd half of 2016 schedule including more dates and classes in Detroit.
Industry News | 2023-11-13 12:31:47.0
Circuit Technology Center announces it has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. They can also propose a trim and lead-form drawing if needed. Dedicated, custom tooling can be fabricated to meet custom package requirements.
