Industry News | 2003-06-18 08:04:27.0
Recently purchased and installed a new DP-1500-2X Dual-Sided Photoimageable Ink Coater from Circuit Automation
Industry News | 2017-07-12 17:13:57.0
Count On Tools Inc. announces the expansion of the Fuji NXT Nozzle Series for the new H24 mounter head. The new high-speed head from Fuji achieves improved productivity over previous models. Standard nozzles from Count On Tools compliment this mounter to provide increased reliability and performance within the Fuji NXT III platform of machines.
Industry News | 2018-01-23 16:15:04.0
Count On Tools will exhibit in Booth #1613 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 through March 1, 2018 at the San Diego Convention Center in Calif. The COT team will focus on its core product lines at the show:
Industry News | 2020-01-06 16:17:36.0
Count On Tools, Inc. (COT) will exhibit in Booth #1528 at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in Calif. The COT team will focus on its core product lines at the show:
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2017-08-10 18:38:21.0
Count On Tools Inc. is pleased to announce that it now offers a complete line of nozzles for the Samsung – Hanwha Techwin EXCEN chip mounters. These nozzle designs enable highly accurate, repeatable, optimized chip placement. The expanded series of Samsung – Hanwha replacement nozzles for the EXCEN HS high0speed placement heads offers a high productivity, low-cost alternative to OEM nozzles. Most standard nozzles are available in a variety of materials, such as durable ceramics.
Industry News | 2017-08-23 12:47:29.0
Count On Tools is pleased to announce that it now offers a complete line of nozzles for the Panasonic AM100 machines. These nozzle designs enable highly accurate, repeatable, optimized chip placement. The AM Series equipment maintains the high standards for capability, flexibility and reliability that customers expect in a cost-effective, incrementally scalable, high-mix SMT solution.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2018-10-18 08:39:14.0
Stencil Technology for SMT production
