Industry News | 2003-02-05 08:29:10.0
In Hopes of Convincing Legislators that there�s Still Time to Resuscitate the State PCB Industry
Industry News | 2003-04-30 08:51:08.0
Electrolube played the role of environmental champion in Australia recently.
Industry News | 2003-04-29 07:30:06.0
Announce their plans to co-sponsor a free online conference on the current state of bare die packaging
Industry News | 2004-09-22 20:15:15.0
IPC and HKPCA�s premier industry event, International Printed Circuit and Electronics Assembly Fair will be held in Dongguan, China from December 8-10, 2004
Industry News | 2013-04-02 17:20:44.0
The SMTA is pleased to announce the program for the 2013 International Conference on Soldering and Reliability being held May 14-17 in Toronto, Ontario, Canada.
Industry News | 2013-06-07 15:41:36.0
IPC Study of Quality Benchmarks for the Electronics Manufacturing Services (EMS) Industry for 2013 is now available from IPC — Association Connecting Electronics Industries®. T
Industry News | 2012-01-13 13:27:59.0
The SMT stencil market has a slew of new options in foil materials, coatings and cutting technologies, all of which promise to improve the solder paste printing process. Which of these options really do help assemblers keep yields up and costs down, and which don’t?
Industry News | 2010-04-16 11:20:45.0
IPC has released updates to key standards that affect your business. New versions of printed board standards IPC-A-600 and IPC-6012 have been released, along with key assembly standards IPC-A-610 and J-STD-001. If you become a member now, you will be eligible to get free copies of all of these standards, saving up to $393. And, of course, as more new standards are published, you can request a copy within 90 days, adding to your savings!
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Industry News | 2010-11-06 17:29:32.0
Industry estimates project that by the end of 2010, printed electronics will be 35 percent of a $1.92 billion printed, thin film and organic electronics market.
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