Industry News: problems during pin in paste solderin (Page 1 of 4)

New IPC-9708 Standard Fills the Void in Test Methods for Pad Cratering

Industry News | 2011-03-31 11:54:23.0

Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.

Association Connecting Electronics Industries (IPC)

Executives to Discuss Managing Challenges in Periods of Transition at IPC APEX EXPO 2021 Managers Forum

Industry News | 2021-02-12 16:57:01.0

New and experienced managers will gather at the Managers Forum at IPC APEX EXPO on March 8 to discuss strategies for thriving during times of crisis.

Association Connecting Electronics Industries (IPC)

What is the LED Panel SMT Production Process?

Industry News | 2022-10-12 07:22:35.0

I.C.T As an SMT Factory Solution Partner, Mainly Provide Full SMT Line Machine. Including SMT Pick and Place Machine, PCB Reflow Oven, SMT Stencil Printer, PCB Wave Soldering Machine, PCB Handing Machine and SMT Peripheral Equipment for Global Customers.

Dongguan Intercontinental Technology Co., Ltd.

Kyzen's to Participate in Technical Sessions during SMTA International 2008

Industry News | 2008-08-07 15:31:41.0

NASHVILLE � August 2008 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will both present and chair technical sessions during the 2008 SMTA International Conference and Exhibition, scheduled to take place August 18-20, 2008, at the Coronado Springs Resort in Orlando, FL.

KYZEN Corporation

Ersa to Offer Demos in Interactive Virtual Showrooms during APEX Virtual EXPO

Industry News | 2021-02-12 16:18:20.0

Kurtz Ersa Inc. today announced plans to participate in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. Ersa has upgraded its demo/application centers to interactive virtual showrooms where the team will give customers in depth and personalized equipment demonstrations for wave soldering, reflow soldering, selective soldering, rework equipment, I4.0 connectivity and more. The company will highlight the EXOS 10/26, Ersa VERSAEYE and and HR 600 XL during the virtual event.

kurtz ersa Corporation

SHENMAO America to Participate in the eSMART Factory Conference

Industry News | 2018-05-20 18:31:27.0

SHENMAO America today announced plans to exhibit at the eSMART Factory Conference, jointly organized by Global SMT & Packaging magazine and the SMTA, on Thursday, May 24, 2018 at the Plug ‘n Play Tech Center in Sunnyvale, CA. SHENMAO will highlight the new PF606-P245 Lead-free Zero Halogen Solder Paste. PF606-P245 paste improves ICT testability by completely removing flux to prevent contamination of test pins during test operation.

Shenmao Technology Inc.

Koh Young to Showcase Award-winning Inspection and Smart Factory Solutions at SMTconnect on May 10-12, 2022, in Nuremberg, Germany

Industry News | 2022-04-28 14:30:28.0

Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will highlight an array of award-winning inspection and measurement solutions at SMTconnnect in booth 4.A-233 on the NürnbergMesse event grounds during 10-12 May 2022. The following is just a glimpse into what Koh Young will have in store for our visitors at the tradeshow:

Koh Young America, Inc.

Why use Via in Pad Design?

Industry News | 2019-11-05 22:08:21.0

Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.

Headpcb

Bob's Soldering Master Class in Chicago at SMTA International

Industry News | 2015-08-25 06:51:43.0

I will be presenting two soldering workshops and one hands-on solder paste printing & inspection feature at SMTA International in September. Watch our video clips to find out more and the new topics we will be covering during my birthday celebrations

ASKbobwillis.com

Koh Young is highlighting its Award-winning True3D Inspection Solutions at IPC APEX EXPO on January 24-26, 2023, in San Diego, CA

Industry News | 2023-01-04 18:57:04.0

Atlanta, Georgia – Koh Young Technology, the industry leader in True3D measurement-based inspection solutions and the Premier Sponsor of IPC APEX EXPO, will deliver live demonstrations of its award-winning inspection and measurement solutions during the live tradeshow in the San Diego Convention Center on January 24-26, 2023, in San Diego, California. Koh Young will highlight several award-winning solutions at the Koh Young America booth (1116). The following is just a glimpse into what Koh Young will have in store for our visitors.

Koh Young America, Inc.

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