Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2011-01-12 17:40:04.0
Check out these Show Highlights, Ways to Save, Networking and Educational Opportunities, and Exhibition Preview.
Industry News | 2016-09-14 17:44:33.0
IPC – Association Connecting Electronics Industries® will present “PCB Troubleshooting” on November 2, 2016 in Raleigh, N.C. in conjunction with regional trade show, PCB Carolina.
Industry News | 2010-05-07 16:01:14.0
New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.
Industry News | 2023-10-30 19:21:14.0
Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die Transfer Film (DTF) process, at this year's productronica 2023 in Munich. Especially for bonding semiconductors such as IGBTs, SiC MOSFETs or GaN HEMTs with Ag on DBC or AMB substrates or for connecting power modules on heat sinks, metallic sintering offers a high-performance solution with maximum reliability.
Industry News | 2004-08-09 16:13:02.0
Two new common-drain, chipscale power MOSFETs that are the industry�s first such p-channel and 30-V n-channel devices were announced today by Siliconix incorporated.
Industry News | 2016-09-07 19:04:13.0
Kurtz Ersa North America is pleased to announce that Viktoria Rawinski, Assistant to the CEO of the Kurtz Ersa Group and head of the Kurtz Ersa Company Museum and the Corporate History Department, will present the paper entitled, “Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate – Process Integration in Industrial Production,” during SMTA International. The presentation is scheduled to take place during Session MFX4, entitled, “Reflow and Soldering Technology: Void Reduction” on Wednesday, September 28, 2016 from 10:30 a.m. to 12 p.m. in Room 49.
Industry News | 2013-07-16 14:26:29.0
SEHO North America, Inc. announces that it has extended the upcoming Selective Soldering Seminar from the SEHO Academy with a ‘Reflow Day.’
Industry News | 2003-06-11 13:37:07.0
With efficiencies better or comparable to competing implementations in the MLF/QFN/Power Block packages, these new devices in the LITTLE FOOT SO 16 feature a 38% or smaller standard footprint, simplifying design, assembly, soldering, and layout.
